LOCTITE® 444™ is a medium-viscosity, fast-curing cyanoacrylate adhesive designed for electronics applications. It is a single-component adhesive that cures upon exposure to humidity. It is suitable for bonding rubbers, plastics, and metals and is typically used with TAK PAK® accelerators for instant curing in electronics assembly.
| Property | Value |
|---|---|
| Uncured Properties | |
| Specific Gravity @ 25°C | 1.05 |
| Viscosity (Brookfield LVF, Spindle 2, 30 rpm) | 550 – 850 mPa·s |
| Cured Properties (after 24 hours @ 22°C) | |
| Coefficient of Thermal Expansion | 80 × 10⁻⁶ K⁻¹ |
| Thermal Conductivity | 0.11 W/(m·K) |
| Glass Transition Temperature (Tg) | 130°C |
| Electrical Properties | |
| Volume Resistivity | 7.2 × 10¹⁵ Ω·cm |
| Surface Resistivity | 66 × 10¹⁵ Ω |
| Dielectric Breakdown Strength | 36.6 kV/mm |
| Dielectric Constant (1 kHz) | 3.0 |
| Dissipation Factor (1 kHz) | 0.028 |
| Mechanical Performance | |
| Lap Shear Strength (Steel, grit blasted) | ≥5.4 N/mm² (≥780 psi) |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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