LOCTITE® AA 317™ is used for bonding close-fitting rigid parts made of metal or ceramic. It cures when confined between close-fitting parts with Activator 734™ applied.
| Property | Value |
|---|---|
| Specific Gravity @ 25 °C | 1.1 |
| Flash Point | See SDS |
| Viscosity (Brookfield – RVT, Spindle 3, 20 rpm, 25 °C) | 2,800 to 4,200 mPa·s (cP) |
| Property | Value |
|---|---|
| Coefficient of Thermal Expansion (ASTM D 3386) | 100×10⁻⁶ K⁻¹ |
| Coefficient of Thermal Conductivity (ISO 8302) | 0.1 W/(m·K) |
| Specific Heat | 0.3 kJ/(kg·K) |
| Property | Value |
|---|---|
| Lap Shear Strength (ISO 4587, Steel, grit blasted) | ≥14 N/mm² (≥2,030 psi) |
| Tensile Strength (ISO 6922, Steel, grit blasted) | 20 to 35 N/mm² (2,900 to 5,075 psi) |
| Condition | % Strength Retained |
|---|---|
| Acetone (22°C, 720h) | 100% |
| Trichlorethylene (22°C, 720h) | 95% |
| Aircraft Fuel JP-4 (93°C, 720h) | 95% |
| Water (93°C, 720h) | 70% |
| Water/Glycol 1:1 (93°C, 720h) | 70% |
| 100% Relative Humidity (82°C, 720h) | 70% |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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