• Item Name: LOCTITE® AA 326
• Manufacturer: Henkel
• Technologies: Acrylic (Polyurethane methacrylate)
• Color: Transparent, yellow to light amber
• Cure Type: Anaerobic, Secondary Cure with Activator
• Package Size: Contact to Techniq VN for details.
• Shelf Life: Contact to Techniq VN for details.
| Property | Value |
|---|---|
| Specific Gravity @ 23°C | 1.05 |
| Viscosity (Brookfield RVT, 25°C) | 18,000 mPa.s |
| Viscosity (EN 12092-MV, shear rate 36 s⁻¹, 25°C) | 15,000 mPa.s |
| Property | Value |
| Elongation at break (ISO 527-3) | 135% |
| Tensile Strength (ISO 527-2) | 34 N/mm² (4,900 psi) |
| Tensile Modulus (ISO 527-2) | 300 N/mm² (44,000 psi) |
| Coefficient of Thermal Expansion (ISO 11359-2) | 80×10⁻⁶ K⁻¹ |
| Thermal Conductivity (ISO 8302) | 0.1 W/(m.K) |
| Specific Heat | 0.3 kJ/(kg·K) |
| Property | Value |
| Dielectric Constant (100 Hz) | 5.6 |
| Dielectric Breakdown Strength (IEC 60243-1) | 30 kV/mm |
| Volume Resistivity (IEC 60093) | 2×10¹³ Ω·cm |
| Surface Resistivity (IEC 60093) | 2×10¹⁷ Ω |
| Condition | Strength |
| Lap Shear Strength (Steel, Activator 7649, 24h @ 23°C) | 15.2 N/mm² (2,200 psi) |
| Tensile Strength (Steel, Activator 7649, 24h @ 23°C) | 24 N/mm² (3,500 psi) |
| Lap Shear Strength (0.25 mm gap, Activator 7649, 24h @ 23°C) | 13.8 N/mm² (2,000 psi) |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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