Item Name: LOCTITE® AA 334™ (Known as LOCTITE® 334™)
Manufacturer: Henkel
Technologies: Acrylic, Modified Acrylic, One-component
Color: Light yellow liquid
Cure Type: Activator / Heat
Package Size: Contact to Techniq VN for details.
Shelf Life: Contact to Techniq VN for detail
LOCTITE® AA 334™ is a one-component modified acrylic adhesive with high viscosity and light-yellow appearance. It requires no mixing and cures with an activator or heat. Designed for motor magnet bonding, it produces durable bonds with excellent impact and peel resistance. The adhesive offers high hardness, good tensile properties, and maintains reliable performance under varied environmental conditions.
Securing permanent magnets in motor assemblies.
Structural bonding where high peel and impact resistance are required.
Heat-assisted curing for assemblies where surface priming is not preferred.
Not recommended for plastics prone to stress cracking or for use in oxygen-rich systems.
| Property | Condition | Value |
|---|---|---|
| Uncured | Appearance | Light yellow liquid |
| Viscosity (25 °C, Spindle TB, 20 rpm) | 50,000–120,000 mPa·s | |
| Specific Gravity (25 °C) | 1.05 | |
| Cure Method | Activator 7387™ / Heat | |
| Cured | Shore Hardness (D) | 70 |
| Tensile Modulus (ISO 527-2) | 1,250 N/mm² (183,000 psi) | |
| Tensile Strength at Break | 21 N/mm² (3,100 psi) | |
| Lap Shear Strength (Steel, 0.05 mm gap) | ≥11 N/mm² (≥1,595 psi) | |
| Lap Shear Strength (Steel, 0.5 mm gap) | ≥3.5 N/mm² (≥505 psi) | |
| 180° Peel Strength (Steel) | 4.4 N/mm (25 lb/in) |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
HQ address: 41 Street 2, Van Phuc Zone, Hiep Binh Phuoc, Thu Duc City, Ho Chi Minh City, 70000, Vietnam
Website: techniq.vn
Email: info@techniq.vn
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.