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LOCTITE® AA 3381 Acrylic Ultraviolet (UV)- Medical device assembly, metal bonding

  • Item Name: LOCTITE® AA 3381
  • Manufacturer: Henkel
  • Technologies: Acrylic (Acrylated urethane), UV-curing, One-component
  • Color: Translucent colorless (uncured)
  • Cure Type: Ultraviolet (UV) light
  • Package Size: Contact to Techniq VN for details
  • Shelf Life: Contact to Techniq VN for details

1. Product Overview

LOCTITE® AA 3381 is a medium-viscosity, one-component UV-curable acrylic adhesive designed for high-speed production. It offers flexible bonding with excellent load-bearing and shock absorption. Primarily used for potting and sealing glass-to-metal joints, it is ideal for medical devices and dissimilar rigid substrate bonding. Complies with Henkel’s ISO-10993 protocol for medical applications.


2. Applications

  • Medical device assembly (ISO 10993 qualified)

  • Glass to metal bonding

  • Dissimilar rigid substrate bonding

  • High-speed production lines

  • Suitable for sterilization processes (EtO, Gamma, 1x steam autoclave)

3. LOCTITE® AA 3381 – Key Technical Data

Property Unmixed/Uncured After Mixing/Curing (UV @ 100 mW/cm² for 30s)
Appearance Translucent colorless liquid
Specific Gravity @ 25°C 1.08
Viscosity (Spindle 4 @ 20 rpm) 3,600 – 6,600 mPa·s
Cure Time (Glass, Zeta® 7200) ≤15 sec @ 50 mW/cm² 7 sec @ 100 mW/cm²
Shore Hardness (Durometer A) ≥72
Elongation at Break 330%
Tensile Strength 7.91 N/mm² (1,135 psi)
Tensile Modulus 18.6 N/mm² (2,670 psi)
Dielectric Strength 37 kV/mm
Surface Resistivity 7.84×10¹⁴ Ω·cm
Volume Resistivity 1.06×10¹⁴ Ω·cm
Dielectric Constant @ 5–50 GHz 3.32 – 2.96
Dissipation Factor @ 5–50 GHz 0.086 – 0.059
UV Depth of Cure (15 sec, 100 mW/cm²) ≥1.6 mm

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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