Item Name: LOCTITE® AA 3927 (Known as LOCTITE® 3927™)
Manufacturer: Henkel
Technologies: UV Acrylic, One-component
Color: Transparent to hazy liquid
Cure Type: Ultraviolet (UV) / Visible light
Package Size: Contact to Techniq VN for details.
Shelf Life: Contact to Techniq VN for details.
LOCTITE® AA 3927 is a one-component, UV/visible light-curing acrylic adhesive formulated for high-speed production applications. It cures in seconds when exposed to proper light intensity, forming flexible and strong bonds with glass, plastics, and metals. The adhesive fluoresces under black light, aiding inspection, and has a viscosity that minimizes migration before curing. It is specifically developed for bonding batteries into plastic holders and other assembly processes requiring rapid cure and strong adhesion.
Bonding glass, plastics (polycarbonate, acrylic, PVC, nylon, PBT), metals, and composites.
Assembly of batteries into holders and electronic device integration.
High-speed production lines requiring instant fixture strength and visual inspection capability.
Situations demanding flexible yet durable bonds with chemical and environmental resistance.
| Property | Still Not Mixed (Uncured) | After Cured |
|---|---|---|
| Appearance | Transparent to hazy liquid | – |
| Fluorescence | Positive under UV light | – |
| Components | One (no mixing required) | – |
| Specific Gravity @25 °C | 1.08 | – |
| Viscosity @25 °C (mPa·s) | 3,000 – 8,000 | – |
| Cure Method | UV / Visible light | – |
| Fixture Time (glass, sec) | ≤5 (depending on light source) | – |
| Tack Free Time (sec) | >60 (depending on light source) | – |
| UV Depth of Cure (mm) | – | ≥2.2 (10 sec @100 mW/cm²) |
| Glass Transition Temperature (°C) | – | 58 |
| Shore Hardness (D) | – | 57 |
| Elongation at break (%) | – | 331 |
| Tensile Strength (N/mm² / psi) | – | 19 / 2,740 |
| Tensile Modulus (N/mm² / psi) | – | 143 / 20,700 |
| Block Shear Strength (N/mm² / psi) | – | 4.1–20.1 depending on substrate |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
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LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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