• Item Name: LOCTITE® AA 3971™
• Manufacturer: Henkel
• Technologies: UV Acrylic
• Color: Transparent
• Cure Type: Ultraviolet (UV) / Visible Light
• Package Size: Contact to Avantek for details.
• Shelf Life: Contact to Avantek for details.
| Uncured Material | Value |
|---|---|
| Specific Gravity @ 25°C | 1.05 |
| Viscosity @ 25°C (Spindle 2, 20 rpm) | 315 mPa·s (cP) |
| Curing Performance | Time (seconds) |
|---|---|
| UV Fixture Time (100 mW/cm² @ 365 nm) | 5 |
| Tack-Free Time (1000 mW/cm² @ 405 nm) | 5 |
| Cured Material Performance | Strength |
|---|---|
| Needle Pullout Strength (Polycarbonate, 22G Cannula) | 178 N (40 lb) |
| Needle Pullout Strength (Polystyrene, 22G Cannula) | 205 N (46 lb) |
| Block Shear Strength (Polycarbonate to Polycarbonate) | 22 N/mm² (3,200 psi) |
| Block Shear Strength (Steel to Glass) | 13 N/mm² (1,900 psi) |
| Environmental Resistance | Retention of Strength (%) |
|---|---|
| 95% RH at 40°C (1000h) | 55% |
| Water Immersion (1000h) | 85% |
| Thermal Stability (Polycarbonate, 22G Cannula, 4 weeks @ 60°C) | 50% |
| Sterilization Resistance (Retention of Strength %) | Gamma 30 kGy | ETO 1 Cycle | Autoclave 5 Cycles |
|---|---|---|---|
| Polycarbonate (22G Cannula) | 95% | 45% | 30% |
| Polystyrene (22G Cannula) | 100% | 55% | – |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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