LOCTITE ABLESTIK 104 is a two-component epoxy adhesive with high shear strength, excellent chemical resistance, and long pot life. It is designed for high-temperature applications, withstanding continuous exposure up to 230°C and short-term exposure up to 280°C.
| Property | Component A (Resin) | Component B (Hardener) | Mixed |
|---|---|---|---|
| Appearance | Black liquid | White powder | – |
| Viscosity @ 25°C | 25,000 mPa·s | – | – |
| Density (g/cm³) | 1.35 | – | 1.4 |
| Shelf Life @ 25°C | 183 days | 183 days | – |
| Mixing Ratio (by weight) | 100:64 | – | – |
| Working Time @ 25°C | – | – | >12 hrs |
| Cure Temperature | Time |
|---|---|
| 120°C | 6 hours |
| 150°C | 3 hours |
| 175°C | 2 hours |
| 200°C | 1 hour |
| Recommended Post-Cure: 2–4 hours at max operating temperature |
| Property | Value |
|---|---|
| Hardness (Shore D) | 90 |
| Coefficient of Thermal Expansion (ppm/°C) | 60 |
| Glass Transition Temperature (°C) | >225 |
| Property | Value |
|---|---|
| Volume Resistivity (Ω·cm) | 10¹⁵ |
| Dielectric Strength (kV/mm) | 15.7 |
| Property | Value (%) |
|---|---|
| TML | 0.52 |
| CVCM | 0.08 |
| Chemical | % Weight Change |
|---|---|
| 30% H₂SO₄ | +0.19 |
| 10% NaCl | +0.21 |
| 10% NaOH | +0.11 |
| Acetone | +0.06 |
| Toluene | +0.04 |
| Test Condition | Strength (N/mm²) | Strength (psi) |
|---|---|---|
| Aluminum @ 25°C | 12.4 | 1,800 |
| Aluminum @ 150°C | 11.7 | 1,700 |
| Aluminum @ 230°C | 9.7 | 1,400 |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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