1. Product Overview
LOCTITE ABLESTIK 2100A is a silver-filled die attach adhesive designed for Pb-free array packaging. It offers high hot/wet adhesion, low stress, ultra-low moisture absorption, and excellent dispensing characteristics. The adhesive can withstand high reflow temperatures (260°C) and is suitable for die sizes up to 12.7 x 12.7 mm.
2. Applications
3. Typical Properties
| Property | Value |
|---|---|
| Uncured Properties | |
| Thixotropic Index (0.5/5 rpm) | 5.3 |
| Viscosity (Brookfield CP51, 25°C, 5 rpm) | 9,000 mPa·s (cP) |
| Work Life @ 25°C | >24 hours |
| Shelf Life @ -40°C | 365 days |
| Curing Performance | |
| Cure Schedule | 30 min ramp to 175°C + 15 min @ 175°C |
| Weight Loss on Cure | 1.3% |
| Cured Properties | |
| CTE (Below Tg) | 65 ppm/°C |
| CTE (Above Tg) | 200 ppm/°C |
| Glass Transition Temperature (Tg) | 60°C |
| Thermal Conductivity @ 121°C | 1.2 W/(m-K) |
| Moisture Absorption @ 85°C/85%RH | 0.27% |
| Mechanical Properties | |
| Tensile Modulus @ -65°C | 3,172 N/mm² (460,000 psi) |
| Tensile Modulus @ 25°C | 1,517 N/mm² (220,000 psi) |
| Tensile Modulus @ 150°C | 172 N/mm² (25,000 psi) |
| Electrical Properties | |
| Volume Resistivity | 0.05 ohm-cm |
| Die Shear Strength | |
| 2 x 2 mm Si die on Ag/Cu leadframe @ 25°C | 9.5 kg-f |
| 3 x 3 mm Si die on PBGA solder mask @ 25°C | 16 kg-f |
| 3 x 3 mm Si die on PBGA solder mask @ 250°C | 3.6 kg-f |
| Hot/Wet Die Shear Strength (85°C/85%RH, 48 hours, 250°C) | 3.5 kg-f |
| Chip Warpage @ 25°C | |
| 7.6 x 7.6 mm chip | 6 µm |
| 12.7 x 12.7 mm chip | 17 µm |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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