1. Product Overview
LOCTITE ABLESTIK 2100A is a silver-filled die attach adhesive designed for Pb-free array packaging. It offers high hot/wet adhesion, low stress, ultra-low moisture absorption, and excellent dispensing characteristics. The adhesive can withstand high reflow temperatures (260°C) and is suitable for die sizes up to 12.7 x 12.7 mm.
2. Applications
3. Typical Properties
| Property | Value |
|---|---|
| Uncured Properties | |
| Thixotropic Index (0.5/5 rpm) | 5.3 |
| Viscosity (Brookfield CP51, 25°C, 5 rpm) | 9,000 mPa·s (cP) |
| Work Life @ 25°C | >24 hours |
| Shelf Life @ -40°C | 365 days |
| Curing Performance | |
| Cure Schedule | 30 min ramp to 175°C + 15 min @ 175°C |
| Weight Loss on Cure | 1.3% |
| Cured Properties | |
| CTE (Below Tg) | 65 ppm/°C |
| CTE (Above Tg) | 200 ppm/°C |
| Glass Transition Temperature (Tg) | 60°C |
| Thermal Conductivity @ 121°C | 1.2 W/(m-K) |
| Moisture Absorption @ 85°C/85%RH | 0.27% |
| Mechanical Properties | |
| Tensile Modulus @ -65°C | 3,172 N/mm² (460,000 psi) |
| Tensile Modulus @ 25°C | 1,517 N/mm² (220,000 psi) |
| Tensile Modulus @ 150°C | 172 N/mm² (25,000 psi) |
| Electrical Properties | |
| Volume Resistivity | 0.05 ohm-cm |
| Die Shear Strength | |
| 2 x 2 mm Si die on Ag/Cu leadframe @ 25°C | 9.5 kg-f |
| 3 x 3 mm Si die on PBGA solder mask @ 25°C | 16 kg-f |
| 3 x 3 mm Si die on PBGA solder mask @ 250°C | 3.6 kg-f |
| Hot/Wet Die Shear Strength (85°C/85%RH, 48 hours, 250°C) | 3.5 kg-f |
| Chip Warpage @ 25°C | |
| 7.6 x 7.6 mm chip | 6 µm |
| 12.7 x 12.7 mm chip | 17 µm |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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