Applications

LOCTITE ABLESTIK 8177 – Epoxy adhesive – Die attach for thermally sensitive electronic components

Item Name: LOCTITE ABLESTIK 8177
Manufacturer: Henkel
• Technologies: Epoxy
Color: Silver
Cure Type: Heat cure
Package Size: Contact to Techniq VN for details.
Shelf Life: 12 months

1. Product Overview

LOCTITE ABLESTIK 8177 is a silver epoxy adhesive designed for die attach applications requiring high thermal and electrical conductivity. The adhesive cures rapidly at low temperatures, making it suitable for thermally sensitive devices. Its silver filler ensures efficient heat dissipation while maintaining reliable mechanical and electrical performance.


2. Applications

  • Die attach for electronic components and semiconductors

  • Applications requiring high thermal conductivity

  • Adhesive use with thermally sensitive devices

  • Electrically conductive bonding in chip attach processes

3. Typical Properties

Property Uncured Material Cured Material
Thixotropic Index (0.5/5 rpm) 5.0
Viscosity, Brookfield CP51, 25°C (mPa·s) 12,000 @ 5 rpm
Specific Gravity 3.91
Work Life @ 25°C 24 hours
Shelf Life @ -40°C 365 days
Cure Schedule 4 minutes @ 130°C
Thermal Conductivity (W/m·K) 3.0
Extractable Ionic Content (ppm) Cl⁻ 10, Na⁺ 5, K⁺ 5
Volume Resistivity (ohm·cm) 0.0001
Die Shear Strength (Si to Ag @ 25°C) 6,300 psi

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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