LOCTITE ABLESTIK 8200T is an electrically conductive die attach adhesive designed for high-reliability package applications. It features:
| Property | Value |
|---|---|
| Thixotropic Index (0.5/5 rpm) | 4.8 |
| Viscosity (Brookfield CP51, 5 rpm, 25°C) | 9,000 mPa·s (cP) |
| Work Life @ 25°C | 24 hours |
| Shelf Life @ -40°C | 365 days |
| Property | Value |
|---|---|
| Physical Properties | |
| Coefficient of Thermal Expansion (CTE) | Below Tg: 61 ppm/°C, Above Tg: 195 ppm/°C |
| Glass Transition Temperature (Tg) | 241°C |
| Thermal Conductivity | 2.5 W/m-K |
| Moisture Absorption (@ 85°C/85% RH) | 0.3% |
| Mechanical Properties (Tensile Modulus, DMTA) | |
| @ -65°C | 9,356 N/mm² (1,356,973 psi) |
| @ 25°C | 7,840 N/mm² (1,137,096 psi) |
| @ 100°C | 6,337 N/mm² (919,104 psi) |
| @ 150°C | 5,092 N/mm² (738,532 psi) |
| @ 200°C | 3,356 N/mm² (486,746 psi) |
| @ 250°C | 2,921 N/mm² (423,655 psi) |
| @ 300°C | 4,345 N/mm² (630,189 psi) |
| Electrical Properties | |
| Volume Resistivity | 0.0001 ohm·cm |
| Test | Result |
|---|---|
| Die Shear Strength (3×3 mm Si die on Ag/Cu leadframe) | @ 25°C: 10 kg-f, @ 200°C: 7 kg-f, @ 250°C: 5.5 kg-f |
| Weight Loss on Cure | 7.0% |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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