LOCTITE ABLESTIK 8301 is a silver-filled, electrically conductive die attach adhesive designed for high-reliability package applications. It features snap cure, low stress, high reliability, and hot/wet die shear strength, making it ideal for a wide range of package sizes. The adhesive also offers improved JEDEC performance and is compatible with PPF, bare copper, and silver substrates.
| Property | Value |
|---|---|
| Technology | Epoxy Hybrid |
| Appearance | Silver |
| Filler Type | Silver |
| Cure | Heat Cure |
| Thixotropic Index (0.5/5 rpm) | 4.8 |
| Viscosity (Brookfield CP51, 25°C, 5 rpm) | 10,000 mPa·s (cP) |
| Work Life (@ 25°C) | 24 hours |
| Shelf Life (@ -40°C) | 365 days |
| Zone | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 |
|---|---|---|---|---|---|---|---|---|
| Temperature (°C) | 150 | 150 | 170 | 170 | 190 | 190 | 240 | 240 |
| Time (seconds) | 60 |
Physical Properties
| Property | Value |
|---|---|
| Chloride (Cl⁻) | <10 ppm |
| Sodium (Na⁺) | <10 ppm |
| Potassium (K⁺) | 5 ppm |
| Tensile Modulus | @ -65°C: 6,300 N/mm² (913,700 psi) @ 25°C: 540 N/mm² (78,800 psi) @ 150°C: 170 N/mm² (24,100 psi) @ 200°C: 70 N/mm² (9,400 psi) @ 250°C: 60 N/mm² (8,700 psi) |
Electrical Properties
| Property | Value |
|---|---|
| Volume Resistivity | 0.0001 ohm-cm |
Performance Properties
| Test | Condition | Result |
|---|---|---|
| Die Shear Strength (2×2 mm Si die) | @ 25°C (Bare Cu leadframe) | 2 kg-f |
| Die Shear Strength (7.6×7.6 mm Si die) | @ 240°C (Cu leadframe) | 15 kg-f |
| Chip Warpage (Post Mold Bake 4h @175°C) | 7.6×7.6 mm chip | 15 µm |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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