LOCTITE ABLESTIK 8700K is a non-conductive, heat-cured epoxy adhesive designed for die attach applications. It provides excellent adhesion to thin film and thick film gold surfaces and retains its dispensed height after curing without slumping. The product meets MIL-STD-883, Method 5011 requirements.
| Property | Value |
|---|---|
| Technology | Epoxy |
| Appearance | White |
| Cure Type | Heat Cure |
| Viscosity (@ 25°C) | 45,000 mPa·s (cP) |
| Work Life (@ 25°C) | 30 days |
| Shelf Life (@ -40°C) | 365 days |
| Cure Schedule | Condition |
|---|---|
| Standard Cure | 1 hour @ 175°C |
| Alternative Cure | 2 hours @ 160°C |
Physical Properties
| Property | Value |
|---|---|
| Coefficient of Thermal Expansion (CTE) | Below Tg: 20 ppm/°C Above Tg: 55 ppm/°C |
| Glass Transition Temperature (Tg) | 165°C |
| Thermal Conductivity (@ 121°C) | 0.5 W/(m-K) |
| Weight Loss (@ 300°C) | 0.35% |
| Moisture Absorption (@ 85°C/85% RH) | 1.98% |
Electrical Properties
| Property | Value |
|---|---|
| Volume Resistivity | 3 × 10¹⁴ ohm-cm |
Adhesion Properties
| Property | Condition | Value |
|---|---|---|
| Die Shear Strength | 2 × 2 mm gold substrate, @ 25°C | 30 kg-f |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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