Item Name: LOCTITE ABLESTIK ABP 2024
Manufacturer: Henkel
Technologies: BMI Hybrid
Color: Contact to Techniq VN for details.
Cure Type: Heat cure
Package Size: Contact to Techniq VN for details.
Shelf Life: 12 months
LOCTITE ABLESTIK ABP 2024 is a one-component, non-conductive BMI hybrid adhesive paste filled with silica. It is specifically designed for image sensor die attach applications, delivering low outgassing at high reflow temperatures up to 260 °C, ensuring minimal contamination in cavity package environments. The product offers high reliability, long shelf life, and consistent performance, making it suitable for critical semiconductor packaging processes.
Die attach for image sensor devices
Semiconductor packaging requiring low outgassing
High-reliability bonding in cavity package applications exposed to reflow processes
| Property | Still not mixed | After mixed / Cured |
|---|---|---|
| Viscosity (25 °C, 5 rpm) | 13,000 mPa·s | – |
| Thixotropic Index (0.5/5.0 rpm) | 4.0 | – |
| Density | 1.3 g/cc | – |
| Work Life @ 25 °C | 24 h | – |
| Shelf Life @ -40 °C | 365 days | – |
| Cure Schedule | 30 min ramp + 30 min @ 175 °C / Alt: 30 min @ 150 °C | Fully crosslinked |
| Glass Transition Temperature (Tg) | – | Tan δ: 47 °C; TMA: -28 °C |
| CTE (0–50 °C / 150–200 °C) | – | 127 ppm/°C / 156 ppm/°C |
| Extractable Ions | – | Cl⁻ <10 ppm, Na⁺ <10 ppm, K⁺ <10 ppm |
| DMA Modulus | – | 510 N/mm² (25 °C); 110–160 N/mm² (100–200 °C) |
| Volume Resistivity | – | 4.7×10¹⁶ ohm·cm |
| Outgassing | – | 0% @ 150–200 °C; 0.4% @ 260 °C |
| Die Shear Strength (2×2 mm Si die on Ag-Cu) | – | 20 kgf @ 25 °C; 3 kgf @ 250 °C |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
HQ address: Thu Duc, Ho Chi Minh City, VietNam
Website: techniq.vn
Email: info@techniq.vn
Tel: +84 88 990 19 29
Copyright © TECHNIQ VIETNAM
Leave your information or connect via Hotline, and our expert team will reach out immediately to provide professional consultation and customized solutions.
Email: info@techniq.vn
Our Technical Support Team is on hand from 8:30 AM to 5:30 PM (GMT+7).
For requests outside these hours, please submit your request form and we will respond at the earliest opportunity.