• Item Name: LOCTITE® ABLESTIK ABP 2025DNP
• Manufacturer: Henkel
• Technologies: Proprietary hybrid chemistry
• Color: Red
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
LOCTITE® ABLESTIK ABP 2025DNP is a red, silica-filled, non-conductive die attach adhesive formulated with proprietary hybrid chemistry. It is designed for array packaging applications such as PBGA, Flex BGA, and Stacking BGA. The adhesive provides excellent adhesion, minimal bleed, high hot/wet die shear strength, and can withstand 260°C reflow, making it suitable for Pb-free applications.
Die attach in PBGA, Flex BGA, and Stacking BGA packages
High-temperature, Pb-free reflow processes
Array packaging applications requiring strong adhesion and minimal bleed
| Property | Before Mixing | After Mixing / Cured |
|---|---|---|
| Appearance | Red paste | Red solid |
| Viscosity (Brookfield CP51, 25°C, 5 rpm) | 13,500 mPa·s | – |
| Thixotropic Index (0.5/5 rpm) | 4.4 | – |
| Density | 1.4 g/cm³ | – |
| Work Life @ 25°C | 16–24 hours (depending on syringe size) | – |
| Shelf Life @ -40°C | 365 days | – |
| Cure Schedule | – | Ramp 30 min to 175°C + 15 min @ 175°C in N₂ |
| Weight Loss on Cure | – | 2.2% |
| Glass Transition Temperature (Tg) by TMA | – | Post mold: 36°C, Post cure: -35°C |
| Coefficient of Thermal Expansion | – | Below Tg: 48 ppm/°C, Above Tg: 147 ppm/°C |
| Storage Modulus (DMTA) | – | 25°C: 491 MPa, 150°C: 22 MPa, 250°C: 80 MPa |
| Extractable Ionic Content | – | Na⁺ <10 ppm, K⁺ <10 ppm, Cl⁻ <10 ppm |
| Thermal Conductivity | – | 0.3 W/(m·K) |
| Moisture Absorption | – | 0.4 wt% (85°C/85% RH saturation) |
| Volume Resistivity | – | 1.4 × 10¹⁶ ohm·cm |
| Die Shear Strength @ 25°C | – | Si die on PBGA: 8 kg-f |
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