• Item Name: LOCTITE ABLESTIK ABP 2030SCR
• Manufacturer: Henkel
• Technologies: Proprietary Hybrid Chemistry
• Color: Silver
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
LOCTITE ABLESTIK ABP 2030SCR is a silver-filled, proprietary hybrid chemistry adhesive designed for high-throughput die attach applications such as smart cards. It is snap-curable and formulated to minimize stress and warpage between dissimilar surfaces. The adhesive offers low-stress bonding across various package sizes, ensuring reliable performance in precision die attachment.
Die attach in smart card packages
High-throughput semiconductor die attachment
Low-stress bonding between dissimilar surfaces
| Property | Before Mixing | After Mixing / Cured |
|---|---|---|
| Appearance | Silver paste | Silver solid |
| Viscosity (Brookfield CP51, 25°C, 5 rpm) | 15,000 mPa·s | – |
| Thixotropic Index (0.5/5 rpm) | 5.0 | – |
| Work Life @ 25°C | 24 hours | – |
| Shelf Life @ -40°C | 365 days | – |
| Cure Schedule | – | 120 sec @ 120°C (alt: 10 sec @ 150°C) |
| Weight Loss on Cure | – | 0.4% |
| Thermal Conductivity | – | 2.0 W/(m·K) |
| Extractable Ionic Content | – | Cl⁻ <10 ppm, Na⁺ <10 ppm, K⁺ <10 ppm |
| Tensile Modulus (DMTA) | – | -65°C: 3,273 N/mm², 25°C: 1,514 N/mm², 150°C: 240.4 N/mm², 250°C: 260.4 N/mm² |
| Volume Resistivity @ 25°C | – | 0.0002 ohm·cm |
| Die Shear Strength @ 25°C | – | Si/Ni: 4.6 kg-f, Si/Ag: 4.6 kg-f, Si/Au: 3.5 kg-f; Si/Ni/Sn/Cu: 25°C: 4.1 kg-f, 150°C: 1.28 kg-f |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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