• Item Name: LOCTITE ABLESTIK ABP 2032S
• Manufacturer: Henkel
• Technologies: Epoxy
• Color: Silver
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
LOCTITE ABLESTIK ABP 2032S is a silver-filled epoxy adhesive designed as a lead-free, electrically conductive alternative to solder. It cures rapidly at low temperatures, providing good stress control for large die packages. The adhesive exhibits strong adhesion, excellent dispensing characteristics, and is compatible with substrates including gold, steel, and silver.
Die attach in semiconductor packages
Pb-free solder replacement
Large die size package bonding on Au, Steel, and Ag substrates
| Property | Before Mixing | After Mixing / Cured |
|---|---|---|
| Appearance | Silver paste | Silver solid |
| Viscosity (Brookfield CP51, 25°C, 5 rpm) | 11,000 mPa·s | – |
| Thixotropic Index (0.5/5 rpm) | 4.5 | – |
| Work Life @ 25°C | 24 hours | – |
| Shelf Life @ -40°C | 365 days | – |
| Cure Schedule | – | 60 min @ 80°C (alt: 3 min @ 150°C, 10 min @ 120°C) |
| Weight Loss on Cure | – | 0.7% |
| Glass Transition Temperature (Tg) | – | 110°C |
| Coefficient of Thermal Expansion | – | Below Tg: 54 ppm/°C, Above Tg: 162 ppm/°C |
| Thermal Conductivity | – | 1 W/(m·K) |
| Extractable Ionic Content | – | Cl⁻ <30 ppm, Na⁺ <20 ppm, K⁺ <20 ppm |
| Dynamic Tensile Modulus (DMA) | – | 25°C: 4,600 N/mm², 100°C: 1,200 N/mm², 250°C: 150 N/mm² |
| Volume Resistivity @ 25°C | – | 0.0002 ohm·cm |
| Die Shear Strength @ 25°C | – | Au: 16 kg-f, Steel: 15.5 kg-f, Ag: 16 kg-f |
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LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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