Applications

LOCTITE ABLESTIK ABP 2036SF – Non-conductive die attach adhesive – High throughput die attach applications

Item Name: LOCTITE ABLESTIK ABP 2036SF
Manufacturer: Henkel
Technologies: Proprietary Hybrid Chemistry
Color: Red
Cure Type: Heat cure
Package Size: Contact to Techniq VN for details.
Shelf Life: 12 months

1. Product Overview

LOCTITE ABLESTIK ABP 2036SF is a red, single-component, non-conductive hybrid die attach adhesive. It is silane-free and formulated for high-throughput die attach applications, designed to minimize stress and warpage between dissimilar surfaces.


2. Applications

  • Non-conductive die attach

  • High-throughput manufacturing

  • Substrates: plastics and metals

  • Silane-free alternative to LOCTITE ABLESTIK 2035SC

3. Typical Properties

Property Uncured Cured
Appearance Red
Technology Proprietary Hybrid Chemistry
Filler Type Silica
Viscosity, Brookfield CP51, 25°C, mPa·s (5 rpm) 12,760
Thixotropic Index (0.5/5 rpm) 4.42
Work Life @ 25°C (25% viscosity increase) 24 h
Shelf Life @ -40°C 365 days
Cure Schedule 15 min @ 150°C
Alternate Cure Schedule 90 s @ 110°C / 60 s @ 120°C / 10 s @ 150°C
Weight Loss on Cure (%) 1.5
Glass Transition Temperature (Tg, DMTA, °C) 125
DSC Onset / Peak Temperature (°C) 75 / 90
Thermal Conductivity (W/m·K) 0.35
Modulus (N/mm² / psi) 25°C: 2,680 / 388,700; 150°C: 52 / 7,470; 250°C: 55 / 8,180
Dielectric Strength (kV/mm) 55
Die Shear Strength (2×2 mm Si on PPF LF, kg/die) 25°C: 12; 150°C: 1.6

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