• Item Name: LOCTITE® ABLESTIK ABP 2037
• Manufacturer: Henkel
• Technologies: Epoxy with silver filler
• Color: Silver paste
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
LOCTITE® ABLESTIK ABP 2037 is a silver-filled, electrically conductive epoxy adhesive formulated as a Pb-free solder alternative for semiconductor and electronic packaging. It offers controlled particle size, strong adhesion, and low-temperature curing. With good dispense performance and stress control, it is suitable for high-reliability die attach applications.
Electronic materials and semiconductor die attach
Package applications requiring Pb-free solder replacement
Situations needing electrical conductivity with reliable adhesion
| Property | Value | Condition/Note |
|---|---|---|
| Uncured Material | ||
| Viscosity (Brookfield CP51) | 27,000 cP | 25°C, 5 rpm |
| Thixotropic Index | 4.6 | – |
| Work Life | 48 h | 25°C |
| Shelf Life | 365 days | -40°C |
| Cure Schedule | 60 min @ 80°C | Recommended |
| Cured Material | ||
| Glass Transition Temp (Tg) | 115°C | by TMA |
| DMA Modulus @ 25°C | 7.7 GPa | Ramp 5°C/min, 1 Hz |
| Volume Resistivity | 4.7 × 10⁻³ ohm·cm | Electrically conductive |
| Pillar Strength | 14 N | to Ni, φ2 mm |
This adhesive combines electrical conductivity with low-temperature curing and strong adhesion, making it suitable for semiconductor assembly where Pb-free and high-reliability bonding is required.
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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