Item Name: LOCTITE ABLESTIK ABP 2041
Manufacturer: Henkel
Technologies: Epoxy
Color: Black paste
Cure Type: Heat cure
Package Size: Contact to Techniq VN for details.
Shelf Life: 12 months
LOCTITE ABLESTIK ABP 2041 is a black, alumina-filled, non-conductive epoxy adhesive. It is a single-component, fast-curing material with low-temperature cure capability, low stress, and high elongation strength. The adhesive combines good thermal conductivity with low warpage, making it highly reliable in compact electronic assemblies. Its formulation enables robust performance in demanding drop tests while ensuring efficient heat dissipation.
Component assembly in consumer electronics
Camera module (CCM) and flexible printed circuit (FPC) attach
Suitable for PCB, Au, and steel substrates
Ideal for high-throughput bonding processes with fast snap cure capability
| Property | Still not mixed | After mixed / Cured |
|---|---|---|
| Appearance | Black paste | – |
| Viscosity (25 °C, 5 rpm) | 15,000 mPa·s | – |
| Thixotropic Index (0.5/5 rpm) | 5.5 | – |
| Pot Life @ 25 °C | 3 days | – |
| Shelf Life @ -40 °C | 365 days | – |
| Cure Schedules | Snap cure: 1 min @ 120 °C / 2 min @ 100 °C / 3 min @ 90 °C; Oven cure: 30 min @ 80 °C / 60 min @ 60 °C | Fully cured adhesive |
| Weight Loss on Cure | 0.4% | – |
| Volume Shrinkage on Cure | 2.5% | – |
| Hardness | – | Shore D 55 |
| Glass Transition Temperature (Tg) | – | 30 °C |
| CTE (below/above Tg) | – | 45 / 150 ppm/°C |
| Thermal Conductivity | – | 0.8 W/m·K |
| Elongation @ Break | – | 105% |
| Dynamic Tensile Modulus | – | 3,000 MPa @ 25 °C |
| Extractable Ions | – | Cl⁻: 150 ppm, Na⁺: 2 ppm, K⁺: 0.3 ppm |
| Die Shear Strength (25 °C) | – | 10 kgf (2×2 mm die on PPF); 8.5 kgf (on PCB) |
| Chip Warpage | – | 2 μm (5×5 mm Si die on PCB) |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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