Item Name: LOCTITE ABLESTIK ABP 2100ANP
Manufacturer: Henkel
Technologies: Proprietary hybrid chemistry
Color: Silver
Cure Type: Heat cure
Package Size: Contact to Techniq VN for details.
Shelf Life: 12 months
LOCTITE® ABLESTIK ABP 2100ANP is a silver-filled, electrically conductive adhesive based on proprietary hybrid chemistry. Designed for die attach in Pb-free BGA packaging, it offers high hot/wet adhesion, ultra-low moisture absorption, and low stress. The product withstands Pb-free solder reflow at 260 °C, ensuring automotive-grade reliability. It provides low bleed, excellent dispensability, and fast cure capability, while being formulated without intentionally added PFAS.
Die attach for PBGA and BGA substrates
High-throughput Pb-free semiconductor packaging
Automotive-grade and high-temperature reflow processes (260 °C)
Suitable for die sizes up to 12.7 × 12.7 mm
| Property | Still not mixed | After mixed / Cured |
|---|---|---|
| Appearance | Silver paste | – |
| Viscosity (25 °C, 5 rpm) | 11,750 mPa·s | – |
| Thixotropic Index (0.5/5 rpm) | 5.0 | – |
| Density | 3.1 g/cm³ | – |
| Work Life @ 25 °C | 24 h | – |
| Shelf Life @ -40 °C | 365 days | – |
| Cure Schedule | Ramp 30 min + 15–30 min @ 175 °C (N₂) | Fully cured conductive adhesive |
| Weight Loss on Cure | 1.27% | – |
| Glass Transition Temp (Tg) | – | 54 °C |
| CTE (below/above Tg) | – | 68 / 152 ppm/°C |
| Storage Modulus (DMTA) | – | 1,932 MPa (25 °C); 273 MPa (150 °C); 352 MPa (250 °C) |
| Thermal Conductivity | – | 1.2 W/m·K |
| Moisture Absorption (85 °C/85% RH) | – | 0.24 wt% |
| Extractable Ions | – | Na⁺ <10 ppm, K⁺ <10 ppm, Cl⁻ <10 ppm |
| Electrical Resistance | – | 0.001 Ω/0.5 sq. in |
| Die Shear Strength | – | 10 kgf (2×2 mm die @25 °C, Ag/Cu, BGA); 15 kgf (5×5 mm die @250 °C, BGA) |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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