Item Name: LOCTITE® ABLESTIK ABP 3311
Manufacturer: Henkel
Technologies: Epoxy
Color: Silver
Cure Type: Heat cure
Package Size: Contact to Techniq VN for details.
Shelf Life: 12 months
LOCTITE® ABLESTIK ABP 3311 is a silver, heat-curable epoxy-based conductive die attach paste designed for LED and other small die attach applications. It provides excellent workability, good adhesion on silver substrates, and reliable electrical performance. The material exhibits strong adhesion at both room and elevated temperatures and ensures high reliability in electronic packaging. Its one-component system simplifies handling while maintaining consistent performance.
Die attach for LED packages and small die applications
Suitable for Ag-based substrates
High-reliability electronic assemblies requiring consistent electrical performance
Uncured Material
| Property | Value |
|---|---|
| Viscosity (Brookfield CP51, 25°C, 5 rpm) | 10,500 mPa·s |
| Thixotropic Index (0.5/5 rpm) | 6.2 |
| Work Life @ 25°C | 24 hours |
| Shelf Life @ -40°C | 365 days |
Cured Material
| Property | Value |
|---|---|
| Recommended Cure | 30 min ramp to 160°C + 90 min @160°C (Air oven) |
| Weight Loss on Cure | 9.5% |
| Coefficient of Thermal Expansion | Below Tg: 48 ppm/°C, Above Tg: 115 ppm/°C |
| Glass Transition Temperature (TMA) | 68 °C |
| Storage Modulus (DMTA) | @25°C: 5,162 MPa, @150°C: 3,695 MPa, @250°C: 994 MPa |
| Extractable Ionic Content | Na⁺ <20 ppm, K⁺ <10 ppm, Cl⁻ <50 ppm |
| Thermal Conductivity | 3.0 W/m·K |
| Volume Resistivity | 2×10⁻⁴ ohm·cm |
| Die Shear Strength (0.5×0.5 mm Ag-BSM die on Ag LF) | RT: 1.52 kg-f, 160°C: 0.76 kg-f, 260°C: 0.45 kg-f |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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