Applications

LOCTITE® ABLESTIK ABP 6395T – Adhesive – Die Attach, Electronic Adhesive

• Item Name: LOCTITE® ABLESTIK ABP 6395T
• Manufacturer: Henkel
• Technologies: Epoxy
• Color: Silver
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months

1. Product Overview

LOCTITE® ABLESTIK ABP 6395T is a one-component, heat-cured, electrically conductive epoxy die attach adhesive. It is designed for high-reliability applications requiring good workability, high thermal conductivity, and strong adhesion to various leadframes and die surfaces.

2. Applications

  • Die attach adhesive for semiconductor packaging
  • Suitable for SOIC, SOP, QFP, and QFN packages
  • Adheres well to Ag, Cu, and PPF leadframes
  • Works with BSM (backside metallization) and non-BSM die

3. Typical Properties

Uncured Properties

Property Value
Appearance Silver
Thixotropic Index (0.5/5 rpm) 6.2
Viscosity (Brookfield CP51, 25°C, 5 rpm) 8,500 mPa·s
Work Life @ 25°C 24 hours
Shelf Life @ -40°C 365 days

Curing Performance

Cure Schedule Conditions
Standard Cure 30 min ramp to 200°C + 30 min at 200°C (in N₂ or air)
Alternate Cure 30 min ramp to 175°C + 60 min at 175°C (in N₂ or air)

Cured Properties

Physical Properties

Property Value
Coefficient of Thermal Expansion (ppm/°C) Below Tg: 54, Above Tg: 112
Glass Transition Temperature (Tg) 7°C
Dynamic Tensile Modulus @ 25°C: 8,146 N/mm² (1,181,477 psi)
@ 150°C: 1,436 N/mm² (208,274 psi)
@ 250°C: 1,144 N/mm² (165,923 psi)

Thermal Properties

Property Value
Thermal Conductivity (W/m-K) Standard Cure: 30
Alternate Cure: 20

Electrical Properties

Property Value
Volume Resistivity 4 × 10⁻⁵ ohm-cm

Adhesion Properties (Die Shear Strength, kg-f)

Condition Ag LF Cu LF PPF LF
@ RT 10 9 9.4
@ 260°C 2.8 2.4 2.6

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