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Thermal Management

LOCTITE ABLESTIK ABP 8037TI – Conductive Adhesive – Die Attach Applications

Item Name: LOCTITE ABLESTIK ABP 8037TI
Manufacturer: Henkel
Technologies: Acrylate-based, silver-filled conductive adhesive
Color: Silver paste
Cure Type: Heat cure
Package Size: Contact to Techniq VN for details.
Shelf Life: 12 months

1. Product Overview

LOCTITE ABLESTIK ABP 8037TI is a silver-filled conductive adhesive designed for die attach applications. It offers excellent electrical and thermal conductivity, strong adhesion, and stability at high temperatures.

2. Applications

  • Die attach for integrated circuits and components
  • Suitable for use with metal leadframes and advanced substrates
  • Compatible with a wide variety of metals and ceramic surfaces, including silver-plated copper and pre-plated leadframes (NiPdAu)

3. Typical Properties

Property Value
Uncured Properties
Appearance Silver paste
Filler Type Silver
Filler Weight (%) 82%
Viscosity (Brookfield, 25°C, Spindle 51, 5 rpm) 11,000 mPa·s (cP)
Thixotropic Index (0.5/5 rpm) 5.8
Work Life @ 25°C 24 hours
Shelf Life @ -40°C 365 days
Curing Performance
Recommended Cure 30 min ramp to 175°C, hold 30 min @ 175°C
Alternate Cure 30 min ramp to 150°C, hold 30 min @ 150°C
Cured Properties
Glass Transition Temperature (Tg) 46°C
Thermal Conductivity 4.1 W/(m·K)
Coefficient of Thermal Expansion (CTE) Below Tg 62 ppm/°C
CTE Above Tg 94 ppm/°C
Mechanical Properties
Young’s Modulus (E) @ 25°C 5,900 N/mm² (855,722 psi)
Young’s Modulus (E) @ 150°C 2,900 N/mm² (420,609 psi)
Electrical Properties
Volume Resistivity 6.00 × 10⁻⁵ ohm·cm
Shear Strength
Die Shear Strength @ 25°C (Ag/Cu LF, 120×120 mil) 17.6 Kg
Die Shear Strength @ 270°C (Ag/Cu LF, 120×120 mil) 7.4 Kg

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BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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