• Item Name: LOCTITE ABLESTIK ABP 8038
• Manufacturer: Henkel
• Technologies: Acrylate
• Color: Gold
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
LOCTITE ABLESTIK ABP 8038 is a gold and palladium-filled acrylate adhesive formulated for high-reliability die attach applications in leadframe packaging. It delivers excellent electrical and thermal conductivity, superior die shear strength, and improved workability. By replacing silver with gold and palladium, the adhesive eliminates silver migration concerns, ensuring long-term performance and stability in sensitive electronic assemblies.
Die attach for PPF and Au leadframe substrates
High-reliability electronic packaging
Soft solder replacement in applications requiring elimination of silver migration
| Property | Unit | Still Not Mixed | After Mixed |
|---|---|---|---|
| Thixotropic Index (0.5/5 rpm) | – | 4.2 | – |
| Viscosity, Brookfield CP51, 25°C, 5 rpm | mPa·s (cP) | 10,000 | – |
| Work Life @ 25°C | hours | 24 | – |
| Shelf Life @ -40°C | days | 365 | – |
| Cure Schedule | – | 30 min ramp to 175°C + 30 min @175°C | – |
| Coefficient of Thermal Expansion, below Tg | ppm/°C | – | 36 |
| Coefficient of Thermal Expansion, above Tg | ppm/°C | – | 80 |
| Glass Transition Temperature (Tg) | °C | – | 20 |
| Thermal Conductivity | W/(m·K) | – | 1.75 |
| DSC On-set Temperature | °C | – | 140 |
| DSC Peak Temperature | °C | – | 155 |
| Extractable Ionic Content @100°C | ppm | – | Cl- 25, Na+ 5, K+ 2 |
| Weight Loss @ 300°C | % | – | 0.5 |
| Moisture Absorption @85°C/85% RH | % | – | 0.37 |
| Volume Resistivity | ohm·cm | – | 0.0008 |
| Die Shear Strength 2×2 mm Au to Au @25°C | kg-f | – | 8 |
| Die Shear Strength 2×2 mm Au to Au @250°C | kg-f | – | 3.5 |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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