• Item Name: LOCTITE ABLESTIK ABP 8062T
• Manufacturer: Henkel
• Technologies: BMI Hybrid
• Color: Silver paste
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
LOCTITE ABLESTIK ABP 8062T is a BMI hybrid silver paste designed for high-performance die attach applications. It offers excellent thermal and electrical conductivity, hydrophobicity, and stability at elevated temperatures, making it suitable as an alternative to soft solder. The adhesive is especially effective for small to medium die sizes, ensuring reliable heat dissipation and high mechanical performance in demanding electronic packages.
Die attach for MOSFETs and power devices
High thermal and electrical conductivity assemblies
Soft solder replacement in electronics requiring enhanced reliability
| Property | Unit | Still Not Mixed | After Mixed |
|---|---|---|---|
| Thixotropic Index (0.5/5 rpm) | – | 6.1 | – |
| Viscosity, Brookfield CP51, 25°C, 5 rpm | mPa·s (cP) | 15,000 | – |
| Filler Content | % | 85 | – |
| Work Life @ 25°C | hours | 24 | – |
| Shelf Life @ -40°C | days | 365 | – |
| Flash Point | – | See SDS | – |
| Cure Schedule | – | 45 min ramp 25→200°C + 30 min @200°C | Alternate: 45 min ramp 25→185°C + 30 min @185°C |
| Coefficient of Thermal Expansion, TMA, Alpha 1 | ppm | – | 100 |
| Coefficient of Thermal Expansion, TMA, Alpha 2 | ppm | – | 150 |
| Tensile Modulus, DMTA @25°C | N/mm² (psi) | – | 4,330 (628,590) |
| Tensile Modulus, DMTA @250°C | N/mm² (psi) | – | 1,380 (200,150) |
| Extractable Ionic Content @100°C | ppm | – | Cl- <10, Na+ <10, K+ <10 |
| Thermal Conductivity | W/(m·K) | – | 24 |
| Volume Resistivity | ohm·cm | – | 5×10⁻⁵ |
| Die Shear Strength 2×2 mm @25°C | Kg | – | >6.0 |
| Die Shear Strength 2×2 mm @260°C | Kg | – | >2.5 |
| Die Shear Strength 1×1 mm Ag backmetal @25°C | Kg | – | >1.5 |
| Die Shear Strength 1×1 mm Ag backmetal @260°C | Kg | – | >1.1 |
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LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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