• Item Name: LOCTITE ABLESTIK ABP 8064T
• Manufacturer: Henkel
• Technologies: Hybrid chemistry
• Color: Silver
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
LOCTITE ABLESTIK ABP 8064T is a silver, conductive hybrid-chemistry adhesive designed for die attach applications requiring high thermal and electrical conductivity. It is suitable as a soft solder replacement and is stable at high temperatures with low outgassing, meeting NASA outgassing standards.
Die attach for QFP and high-power devices
Integrated circuit attachment onto metal leadframes
Wide range of package sizes
High-reliability applications where thermal/electrical conductivity is critical
| Property | Uncured Material | Cured Material |
|---|---|---|
| Appearance | Silver | – |
| Technology | Hybrid chemistry | – |
| Cure Type | Heat cure | – |
| Filler Content (%) | 85 | – |
| Viscosity, Brookfield CP51 @ 25°C (mPa·s) | 12,000 @ 5 rpm | – |
| Thixotropic Index (0.5/5 rpm) | 5.8 | – |
| Work Life @ 25°C | 24 hours | – |
| Shelf Life @ -40°C | 365 days | – |
| Cure Schedule | 60 min ramp to 180°C + 60 min hold; alt: 60 min ramp to 140°C + 60 min hold in N2 oven | – |
| Glass Transition Temperature (°C) | – | 44.5 |
| Coefficient of Thermal Expansion (ppm/°C) | – | Alpha 1: 47; Alpha 2: 136 |
| Tensile Modulus (N/mm²) | – | 5,260 @ 25°C; 1,280 @ 250°C |
| Thermal Conductivity (W/m·K) | – | 22 |
| Volume Resistivity (ohm-cm) | – | 2.0×10⁻⁵ |
| Extractable Ionic Content (ppm) | – | Cl⁻ <10, Na⁺ <10, K⁺ <10 |
| Die Shear Strength (kg) | – | 3×3 mm Si die on PPF LF: 12.18 @25°C, 5.6 @260°C; 5×5 mm: 12.19 @260°C; 8×8 mm: 18.54 @260°C |
| Outgassing Properties (%) | – | TML: 0.25; CVCM: 0.05; WVR: 0.02 |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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