• Item Name: LOCTITE® ABLESTIK ABP 8065TNP
• Manufacturer: Henkel
• Technologies: BMI Acrylate
• Color: Silver paste
• Cure Type: Heat cure; Snap cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
LOCTITE ABLESTIK ABP 8065TNP is a silver-filled BMI acrylate conductive die attach paste. It offers medium to high thermal conductivity, excellent electrical conductivity, and strong die shear strength. The material does not contain intentionally added PFAS, making it more sustainable. With its stamping and dispensing capability, it provides efficient application for bonding small die in high-reliability electronic packages. It also serves as a soft solder alternative where high thermal and electrical performance is required.
Conductive die attach for small die in semiconductor packages
High-reliability power devices requiring efficient heat dissipation
Alternative to soft solder for enhanced thermal/electrical performance
Compatible with Au, Ag, Cu, and AgCu leadframes
| Property | Still Not Mixed | After Curing |
|---|---|---|
| Appearance | Silver paste | Solid adhesive |
| Technology | BMI Acrylate, silver-filled | Crosslinked/sintered matrix |
| Filler Type | Silver | — |
| Viscosity @25°C, 5 rpm | 15,600 mPa·s | — |
| Thixotropic Index (0.5/5 rpm) | 6.6 | — |
| Density | 4.0 g/cm³ | — |
| Work Life | 24 h @25°C | — |
| Shelf Life | 12 months @ –40°C | — |
| Cure Schedule | Ramp to 175°C (30 min) + hold 60 min; alt: ramp to 200°C (45 min) + hold 60 min; Snap cure 3 min @200–220°C | Fully cured adhesive |
| Weight Loss on Cure | — | 2% |
| Coefficient of Thermal Expansion (CTE) | — | 58 ppm/°C (below Tg); 133 ppm/°C (above Tg) |
| Glass Transition Temp (Tg, DMA) | — | 152°C |
| Storage Modulus (DMA) | — | 6,260 MPa @25°C |
| Ionic Content | — | Cl⁻ <10 ppm; Na⁺ <10 ppm; K⁺ <10 ppm |
| Thermal Conductivity | — | 10 W/m·K |
| Volume Resistivity | — | 3×10⁻⁵ ohm·cm |
| Die Shear Strength | — | 3.7 kgf (1×1 mm Au die on Au pad); 4.6 kgf (1×1 mm Si die on AgCu LF) |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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