• Item Name: LOCTITE® ABLESTIK ABP 8068TB
• Manufacturer: Henkel
• Technologies: Semi-sintering, Silver-filled
• Color: Silver liquid
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
LOCTITE ABLESTIK ABP 8068TB is a silver-filled, semi-sintering die attach adhesive formulated for semiconductor packages with high thermal and electrical requirements. It provides excellent adhesion, low stress, and high thermal stability, making it a suitable alternative to solder pastes. Compared to its predecessor, LOCTITE ABLESTIK ABP 8068TA, this version offers improved resin bleed control.
| Property | Value |
|---|---|
| Thixotropic Index (0.5/5 rpm) | 5.5 |
| Viscosity (Brookfield CP51, 25°C) | 11,500 mPa·s |
| Work Life @ 25°C | 16 hours |
| Open Time @ 25°C | 2 hours |
| Shelf Life @ -40°C | 365 days |
| Die Size | Cure Profile |
| <5 x 5 mm | 25°C to 130°C (30-60 min), ramp to 200°C (120 min) in N2 or air oven |
| >5 x 5 mm | 25°C to 130°C (120 min), ramp to 200°C (120 min) in N2 or air oven |
| Alternative Cure (Ag, Au, PPF substrates) | 25°C to 130°C (30 min), ramp to 175°C (60 min) in N2 or air oven |
| Property | Value |
| Glass Transition Temperature (Tg) | 25°C |
| CTE Below Tg | 25 ppm/°C |
| CTE Above Tg | 103 ppm/°C |
| Thermal Conductivity | 100 W/m-K |
| Moisture Absorption | 0.21% |
| Volume Resistivity | 7×10⁻⁶ Ω·cm |
| Die Size | Substrate | Shear Strength (kg-f) |
| 1 x 1 mm | Ag | 1.5 |
| Cu | 1.6 | |
| PPF | 1.2 | |
| 2 x 2 mm | Ag | 5.0 |
| Cu | 6.5 | |
| PPF | 4.5 | |
| 3 x 3 mm | Ag | 10.9 |
| Cu | 10.8 | |
| PPF | 10.0 |
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