• Item Name: LOCTITE ABLESTIK ABP 8151D7
• Manufacturer: Henkel
• Technologies: Silicone
• Color: Black
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
LOCTITE ABLESTIK ABP 8151D7 is a silicone-based, electrically non-conductive die attach adhesive engineered for MEMs package applications. It combines low modulus with low-temperature cure capability, enabling safe bonding of delicate microelectromechanical structures while maintaining mechanical compliance.
Die attach for MEMs packages
Low-stress applications where delicate or fragile dies require protection
Automated or manual dispensing in precision microelectronics
| Property | Unit | Value |
|---|---|---|
| Appearance | – | Black liquid |
| Technology | – | Silicone |
| Viscosity, Brookfield CP51, 25°C, 5 rpm | mPa·s (cP) | 12,000 |
| Thixotropic Index | – | 3.5 |
| Work Life @ 25°C | hours | 48 |
| Shelf Life @ -20°C | days | 365 |
| Cure Schedule | – | 30 min ramp to 150°C, hold 30 min |
| Alternate Cure | – | 30 min ramp to 80°C, hold 120 min |
| Hardness, Shore A | – | 80 |
| Dynamic Tensile Modulus @ 25°C | N/mm² | 25.2 |
| Die Shear Strength 1×1 mm Si die on laminate | Kg | 1.5 |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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