Item Name: LOCTITE® ABLESTIK ABP 8200TNP
Manufacturer: Henkel
Technologies: Proprietary hybrid chemistry
Color: Silver
Cure Type: Heat cure
Package Size: Contact to Techniq VN for details.
Shelf Life: 12 months
LOCTITE® ABLESTIK ABP 8200TNP is a silver, heat-curable conductive die attach paste based on proprietary hybrid chemistry with silver filler. Designed for high-reliability electronic packages, it delivers robust thermal and electrical conductivity. The material provides excellent adhesion to a wide range of substrates including Cu, rough Cu, Ag, and PPF leadframes, and accommodates small to large die sizes. It offers controlled bondline thickness (RBO), snap and oven cure capability, and is formulated without PFAS ingredients, ensuring environmental compliance.
Conductive die attach for semiconductor devices
Suitable for small to large die sizes
Typical package applications: SOP, SOT, DFN, QFN, QFP
Key substrates: Cu, rough Cu, Ag, PPF leadframes
Uncured Material
| Property | Value |
|---|---|
| Viscosity (Brookfield CP51, 25°C, 5 rpm) | 10,000 mPa·s |
| Thixotropic Index (0.5/5 rpm) | 5.3 |
| Work Life @ 25°C | 24 hours |
| Shelf Life @ -40°C | 365 days |
Cured Material
| Property | Value |
|---|---|
| Recommended Oven Cure | 30 min ramp to 175°C + 60 min @175°C, N₂ |
| Recommended Snap Cure | 6 zones: 140–200°C, total 240 s, N₂ |
| Weight Loss on Cure | 7% |
| Glass Transition Temperature (DMTA) | 240 °C |
| Coefficient of Thermal Expansion (CTE) | Below Tg: 61 ppm/°C, Above Tg: 195 ppm/°C |
| Thermal Conductivity | 2.5 W/m·K |
| Tensile Modulus (DMA) | @25°C: 4,515 MPa, @150°C: 2,180 MPa, @250°C: 972 MPa |
| Extractable Ionic Content | Cl⁻ <10 ppm, Na⁺ <10 ppm, K⁺ <30 ppm |
| Volume Resistivity | 1×10⁻⁴ ohm·cm |
| Die Shear Strength (3×3 mm Si die, kg-f) | Cu LF: 25°C 15 / 260°C 6; Ag LF: 25°C 15 / 260°C 6; PPF LF: 25°C 15 / 260°C 6 |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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