• Item Name: LOCTITE® ABLESTIK ABP 8290A
• Manufacturer: Henkel
• Technologies: Epoxy
• Color: Silver
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
LOCTITE® ABLESTIK ABP 8290A is a silver-filled, heat-curable epoxy adhesive designed as a conductive die attach paste for semiconductor applications. It is optimized for high-reliability packages, with low stress, low bleed, and improved JEDEC performance. Best MRT performance is achieved for die sizes <200 mils.
Conductive die attach for semiconductor packages
High-reliability die bonding applications
Small to medium die sizes (<200 mils)
Package applications requiring low stress and low resin bleed
| Property | Value |
|---|---|
| Uncured Material | |
| Viscosity, Brookfield CP51, 25°C, mPa·s (cP) | 9,000 |
| Thixotropic Index (0.5/5 rpm) | 5.7 |
| Work Life @ 25°C, hours | 24 |
| Shelf Life @ -40°C, days | 365 |
| Curing Performance | |
| Recommended Cure | 30 min ramp to 175°C + 15 min hold @ 175°C |
| Alternate Cure | 30 min ramp to 100°C; 30 min hold @100°C; 15 min ramp to 175°C; 15 min hold @175°C |
| Weight Loss on Cure, % | 3 (30 min ramp to 175°C + 60 min hold) |
| Cured Material | |
| Glass Transition Temperature (Tg), °C | 26 |
| Coefficient of Thermal Expansion, ppm/°C | Below Tg: 44, Above Tg: 197 |
| Thermal Conductivity, W/(m·K) | 2.6 |
| Extractable Ionic Content, ppm | Cl⁻ <30, Na⁺ <20, K⁺ <10 |
| Dynamic Tensile Modulus, DMA, N/mm² | 25°C: 4,985; 150°C: 523; 250°C: 132 |
| Electrical Properties | Volume Resistivity: 0.008 Ω·cm |
| Adhesion Properties | Die Shear Strength: 2×2 mm Si-Ag/Cu RTDSS on Cu LF: 16 kg/die |
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