• Item Name: LOCTITE ABLESTIK ABP 84-3JT
• Manufacturer: Henkel
• Technologies: BMI Hybrid
• Color: Light ivory
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
LOCTITE ABLESTIK ABP 84-3JT is a light ivory, BMI hybrid, non-conductive die attach adhesive formulated for high-reliability semiconductor packaging applications. It provides good adhesion to Cu and Ag, minimal resin bleed-out, and snap curable properties. The adhesive contains 1 mil spacers to control bondline and stress during processing, making it ideal for wire bonding applications.
Die attach for SOP, SOT, QFN, and DFN packages
High-reliability semiconductor packaging
Copper and silver wire bonding applications requiring minimal die shift
| Property | Before Mixing | After Mixing / Cured |
|---|---|---|
| Appearance | Light ivory liquid | Solid |
| Viscosity (Brookfield, 25°C, 5 rpm) | 10,900 mPa·s | – |
| Thixotropic Index (0.5/5 rpm) | 4.4 | – |
| Work Life @ 25°C | 3 days | – |
| Shelf Life @ -40°C | 365 days | – |
| Cure Schedule | – | Ramp 30 min to 175°C + 60 min @ 175°C in N₂ |
| Alternate Cure | – | Ramp 30 min to 200°C + 30 min @ 200°C in N₂ |
| Snap Cure | – | 160–220°C over 3–5 min total |
| Weight Loss on Cure | – | 3.4% |
| Glass Transition Temperature (Tg) by TMA | – | 56°C |
| Coefficient of Thermal Expansion | – | Below Tg: 63 ppm/°C, Above Tg: 117 ppm/°C |
| Thermal Conductivity | – | 0.6 W/(m·K) |
| Extractable Ionic Content | – | Na⁺ <10 ppm, K⁺ <10 ppm, Cl⁻ <10 ppm |
| Linear Shrinkage | – | 2.4% |
| DMA Modulus | – | 25°C: 2,950 MPa, 150°C: 589 MPa, 250°C: 200 MPa |
| Volume Resistivity @ 500V | – | 1.5 × 10¹⁶ ohm·cm |
| Die Shear Strength @ 25°C | – | Si die on Cu: 17 kg-f, Si die on Ag: 17.3 kg-f |
| Die Shear Strength @ 250°C | – | Si die on Cu: 4.2 kg-f, Si die on Ag: 2.1 kg-f |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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