• Item Name: LOCTITE ABLESTIK ABP 8611
• Manufacturer: Henkel
• Technologies: BMI Hybrid
• Color: Light yellow paste
• Cure Type: Heat cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: Contact to Techniq VN for details.
LOCTITE ABLESTIK ABP 8611 is a BMI hybrid, heat-curable die attach adhesive presented as a light yellow paste. It exhibits high adhesion to metal leadframes, excellent dielectric properties, and maintains a high modulus at elevated temperatures. The formulation is particularly suited for small die applications and copper wire bonding, minimizing die shift during processing while preventing current leakage and short circuits in voltage isolation scenarios.
Die attach in semiconductor packaging
Component attach for small dies
Copper wire bonding applications
Voltage isolation applications requiring high dielectric performance
| Property | Value |
|---|---|
| Uncured Material | |
| Viscosity, Brookfield CP51, 25°C, mPa·s (cP) | 16,000 |
| Thixotropic Index (0.5/5 rpm) | 3.8 |
| Work life @ 25°C, hours | 24 |
| Curing Performance | |
| Recommended cure | 30 min ramp to 175°C + 60 min @ 175°C |
| Cured Material | |
| Bulk Thermal Conductivity, W/(m·K) | 0.7 |
| Tensile Modulus | 25°C: 5,000 N/mm² (725,188 psi), 200°C: 550 N/mm² (79,770 psi), 250°C: 450 N/mm² (65,266 psi) |
| Volume Resistance, ohm-cm | @700 V: 9.9×10¹⁸, @1,000 V: 1.4×10¹⁹ |
| Die Shear Strength, kgf | 2×2 mm Si die: Bare Cu LF @25°C: 10.5, @260°C: 2.5; Ag/Cu LF @25°C: 11.0, @260°C: 3.0; PPF LF @25°C: 10.5, @260°C: 1.5 |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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