• Item Name: LOCTITE ABLESTIK ABP 8900NC-1B1
• Manufacturer: Henkel
• Technologies: Epoxy with PTFE filler
• Color: Yellow
• Cure Type: Heat cure; Snap cure
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
LOCTITE ABLESTIK ABP 8900NC-1B1 is a yellow, non-conductive epoxy die attach paste featuring PTFE filler. Engineered for high-throughput semiconductor die attach applications, it offers fast and snap-curable processing, high mechanical strength, controlled bondline thickness, low resin bleed, moderate stress absorption, and excellent dispensability. It is designed for small to medium package sizes and ensures consistent performance across various leadframe substrates.
Non-conductive die attach for semiconductor packages
High-throughput chip attach processes
Adhesion on substrates including bare Cu, Ag-plated Cu, Pd-plated Cu, and various leadframes
Applications requiring precise bondline thickness (20–25 µm)
Suitable for minimizing chip warpage in medium-sized dies
| Property | Uncured Material | Cured Material |
|---|---|---|
| Viscosity, Brookfield CP51 @ 25°C (mPa·s) | 12,500 @ 5 rpm | – |
| Thixotropic Index (0.5/5 rpm) | 5.9 | – |
| Work Life @ 25°C | 24 hours | – |
| Shelf Life @ -40°C | 365 days | – |
| Weight Loss on Cure (%) | – | 2.1 |
| Recommended Cure | 30 min ramp to 175°C + 15 min @ 175°C | – |
| Coefficient of Thermal Expansion (ppm/°C) | – | 65 below Tg / 162 above Tg |
| Glass Transition Temperature (°C) | – | 19 |
| Tensile Modulus (N/mm²) | – | 1,310 @ 25°C; 117 @ 150°C; 62 @ 250°C |
| Extractable Ionic Content (ppm) | – | Cl⁻ ≤20, Na⁺ ≤10, K⁺ ≤10 |
| Water Extract Conductivity (µmhos/cm) | – | 105 |
| Thermal Conductivity (W/m·K) | – | 0.3 |
| Volume Resistivity (ohm·cm) | – | 2.3×10¹³ |
| Die Shear Strength (kg-f) | – | 2×2 mm Si Die @ 25°C: 12.1–13.8 across substrates; 3×3 mm Si Die up to 25°C–250°C: 1.0–24.1 depending on substrate & temperature |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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