LOCTITE ABLESTIK ABP 8910T is a BMI Hybrid die attach adhesive with high thermal conductivity, electrical insulation, and high reliability. It is designed for medium to large die sizes and offers high MRT performance.
| Property | Value |
|---|---|
| Thixotropic Index (0.5/5 rpm) | ≥4.5 |
| Viscosity (Brookfield CP51, 25 °C, 5 rpm) | 13,000 mPa·s (cP) |
| Work Life @ 25°C | 24 hours |
| Shelf Life @ -40°C | 365 days |
| Cure Schedule | Condition |
|---|---|
| Step 1 | 30-minute ramp to 175°C |
| Step 2 | 15 minutes at 175°C |
| Property | Value |
|---|---|
| Coefficient of Thermal Expansion (CTE) (ppm/°C) | Below Tg: 28, Above Tg: 96 |
| Glass Transition Temperature (Tg) | 30°C |
| Thermal Conductivity | 1.3 W/(m·K) |
| Extractable Ions (ppm) | Cl⁻: ≤20, Na⁺: ≤20, K⁺: ≤20 |
| Temperature | Tensile Modulus (N/mm²) | Tensile Modulus (psi) |
|---|---|---|
| -65°C | 10,270 | 1,488,960 |
| 25°C | 8,870 | 1,285,905 |
| 150°C | 2,030 | 294,860 |
| 200°C | 1,096 | 158,920 |
| 250°C | 1,007 | 146,015 |
| Condition | Substrate | Strength (kg-f/die) |
|---|---|---|
| @ 25°C | Silver | 15.4 |
| @ 200°C | Silver | 5.5 |
| @ 250°C | Silver | 4.4 |
| Post Mold Bake (PMB) | Silver | 4.3 |
| Copper | 16.7 | |
| PPF | 2.1 | |
| Alloy 42 | 8.5 | |
| PMB + 5 min @ 270°C | Silver | 2.0 |
| Copper | 15.6 | |
| PPF | 1.9 | |
| Alloy 42 | 8.1 | |
| PMB + Moisture | Silver | 1.1 |
| Copper | 4.6 | |
| PPF | 1.4 | |
| Alloy 42 | 1.9 |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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