• Item Name: LOCTITE ABLESTIK CE 3104WXL
• Manufacturer: Henkel
• Technologies: Epoxy-based electrically conductive adhesive
• Color: Silver
• Cure Type: Heat cure (125–150°C)
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 12 months
LOCTITE ABLESTIK CE 3104WXL is a silver-filled, heat-cured epoxy adhesive designed as a Pb-free, electrically conductive alternative to solder. It features controlled particle size, low cure temperature, and excellent printability via stencil or screen printing. With low surface tension, it effectively prevents bridging on ultra-fine pitch assembly patterns (<500 µm).
This adhesive is primarily used for surface mount device (SMD) component attachment on Sn, Sn/Pb, and OSP-coated Cu surfaces. It is suitable for fine-pitch electronic assembly processes requiring high electrical conductivity and reliable mechanical bonding.
| Property | Unit | Before Mixing (Uncured) | After Mixing / Cured |
|---|---|---|---|
| Technology | — | Epoxy | — |
| Appearance | — | Silver | Silver solid |
| Cure Type | — | Heat cure | — |
| Filler Type | — | Silver (74% wt) | — |
| Thixotropic Index | — | 6.0 | — |
| Viscosity (25°C, 15 s⁻¹) | mPa·s (cP) | 65,000 | — |
| Work Life (25°C) | days | 3 | — |
| Shelf Life (-40°C) | days | 365 | — |
| Cure Schedule | °C / min | 125°C/5 min or 150°C/3 min | Fully cured solid |
| Tensile Lap Shear Strength | MPa | — | 9 |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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