Applications

LOCTITE® ABLESTIK CE 8500-S110 – Electrically conductive adhesive film for semiconductor and optoelectronic device assembly

  • Item Name: LOCTITE ABLESTIK CE 8500-S110
  • Manufacturer: Henkel
  • Product Category: Electrically Conductive Adhesive
  • Technologies: Modified Epoxy, One-Component, Solventless
  • Applications: Component assembly, bonding applications with mismatched CTE
  • Color: Silver
  • Cure Type: Heat cure
  • Package Size: Contact Techniq VN for details.
  • Shelf Life: Contact Techniq VN for details.

1. Product Overview

LOCTITE ABLESTIK CE 8500-S110 is a one-component, solventless, modified epoxy adhesive designed for component assembly. It offers low stress, good adhesion on various surfaces, and contains 100 µm spacers for bondline thickness control. This electrically conductive adhesive is suitable for applications with mismatched coefficients of thermal expansion (CTE) and operates at temperatures up to 200°C.

2. Applications

  • Component assembly
  • Electrically conductive adhesive applications
  • Bonding of surfaces with mismatched CTE

3. Typical Properties

Uncured Material
Property Value
Appearance Silver
Viscosity (10 rpm, 25°C) 130,000 mPa·s (cP)
Density 3.12 g/cm³
Shelf Life (@ -25 to -18°C) 122 days
Curing Performance
Cure Condition Time
110°C 2 hours
120°C 90 minutes
150°C 40 minutes
175°C 15 minutes
Cured Material
Property Value
Glass Transition Temp (Tg) 24°C
Thermal Conductivity 4 W/(m-K)
Volume Resistivity 1 x 10⁻³ ohm-cm
Tensile Lap Shear Strength 3 N/mm² (435 psi)
Extractable Ionic Content
Ion Type Content (ppm)
Chloride (Cl⁻) 150
Sodium (Na⁺) 10
Potassium (K⁺) 10
Ammonium (NH₄⁺) 10

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