LOCTITE ABLESTIK CE3920 is a one-component, electrically conductive epoxy adhesive designed for stencil/screen printing and SMT assembly applications. It features:
| Properties | Values |
|---|---|
| Uncured Material | |
| Viscosity @ 5 rpm | 26,100 mPa·s (cP) |
| Thixotropic Index | 5.7 |
| Shelf Life @ -40°C | 6 months |
| Curing Performance | |
| Cure Schedule (Batch) | 5 min @ 150°C |
| Cured Material | |
| Physical Properties | |
| Coefficient of Thermal Expansion (CTE) | Below Tg: 29 ppm/°C Above Tg: 130 ppm/°C |
| Glass Transition Temperature (Tg) | 119°C |
| Extractable Ions | |
| Chloride (Cl⁻) | 5.1 ppm |
| Sodium (Na⁺) | 0.6 ppm |
| Potassium (K⁺) | 0.2 ppm |
| Electrical Properties | |
| Volume Resistivity @ 25°C | 0.0003 ohm-cm |
| Mechanical Properties | |
| Die Shear Strength (2×2 mm Si die on Ag Leadframe) | @ 25°C: 36.5 N/mm² (5,290 psi) @ 250°C: 1.7 N/mm² (250 psi) |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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