Applications

LOCTITE® ABLESTIK CE3920 – Electrically conductive adhesive film for LED die attach and semiconductor packaging

  • Item Name: LOCTITE ABLESTIK CE3920
  • Manufacturer: Henkel
  • Product Category: Electrically Conductive Epoxy Adhesive
  • Technologies: Epoxy, Electrically Conductive, Thermosetting
  • Applications: SMD interconnect formation, stencil/screen printing, SMT assembly
  • Color: Silver
  • Cure Type: Heat cure (5 min @ 150°C)
  • Package Size: Contact Techniq VN for details

1. Product Overview

LOCTITE ABLESTIK CE3920 is a one-component, electrically conductive epoxy adhesive designed for stencil/screen printing and SMT assembly applications. It features:

  • Pb-free alternative to solder
  • Low viscosity and low coefficient of thermal expansion (CTE)
  • No post-cure required
  • Low-temperature heat cure
  • Long work life for enhanced production efficiency

2. Applications

  • SMD interconnect formation
  • Stencil and screen printing
  • Dispense or printing applications in SMT assembly

3. Typical Properties

Properties Values
Uncured Material
Viscosity @ 5 rpm 26,100 mPa·s (cP)
Thixotropic Index 5.7
Shelf Life @ -40°C 6 months
Curing Performance
Cure Schedule (Batch) 5 min @ 150°C
Cured Material
Physical Properties
Coefficient of Thermal Expansion (CTE) Below Tg: 29 ppm/°C Above Tg: 130 ppm/°C
Glass Transition Temperature (Tg) 119°C
Extractable Ions
Chloride (Cl⁻) 5.1 ppm
Sodium (Na⁺) 0.6 ppm
Potassium (K⁺) 0.2 ppm
Electrical Properties
Volume Resistivity @ 25°C 0.0003 ohm-cm
Mechanical Properties
Die Shear Strength (2×2 mm Si die on Ag Leadframe) @ 25°C: 36.5 N/mm² (5,290 psi) @ 250°C: 1.7 N/mm² (250 psi)

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