1. Product Overview
LOCTITE ABLESTIK G 500HF is a one-component, heat-cured epoxy adhesive and sealant designed for assembly applications. It appears gray, is sag resistant, non-abrasive, and maintains adhesion even on vertical surfaces. The adhesive offers strong bonding at elevated temperatures, long shelf life at room temperature, and excellent resistance to heat and moisture. Its low halogen content (<1500 ppm Cl & Br) makes it suitable for sensitive electronic and industrial uses. Operating temperature ranges from -40 °C to +180 °C.
2. Applications
This adhesive is widely used in electrical and electronic assembly, especially for insulation and attaching leads to coils. It is compatible with substrates such as copper, ferrite, rigid plastics, and other metals. It is particularly suitable for general-purpose bonding where high adhesion and resistance to environmental factors are required.
3. Typical Properties
| Property |
Uncured Material |
Cured Material |
| Density |
1.45 g/cm³ |
– |
| Sag Resistance |
600–900 mils |
– |
| Press Flow |
30–60 seconds |
– |
| Shelf Life @ 25°C |
3 months |
– |
| Cure Schedule |
60 min @ 125°C / 20 min @ 150°C / 5 min @ 175°C |
Post-cure: 2–4 hrs at use temperature |
| Hardness (Shore D) |
– |
85 @ 25°C; 70 @ 120°C |
| Volume Resistivity |
– |
3 × 10¹⁵ ohm-cm @ 25°C |
| Lap Shear Strength (Al–Al) |
– |
17.5 MPa (2558 psi) |
| Operating Temperature |
– |
-40 to +180 °C |
This adhesive balances ease of use with excellent mechanical and electrical performance, ensuring reliable long-term bonding across a variety of substrates in challenging operating environments.