• Item Name: LOCTITE ABLESTIK G 909
• Manufacturer: Henkel
• Technologies: Epoxy
• Color: Gray
• Cure Type: Heat cure (100–150°C)
• Package Size: Contact to Techniq VN for details.
• Shelf Life: 4.5 months
1. Product Overview
LOCTITE ABLESTIK G 909 is a one-component, heat-cured epoxy adhesive formulated for very high-strength structural bonding. It has a gray appearance, non-sag and thixotropic characteristics, and delivers excellent peel and tensile shear strength over a broad temperature range. With strong adhesion to difficult surfaces, including oily steel, the adhesive ensures durability in demanding operating environments. It is designed to bond dissimilar substrates exposed to temperatures from -40 °C to +150 °C, making it suitable for structural and industrial uses where strength and reliability are critical.
2. Applications
This adhesive is mainly used for high-strength structural bonding applications. It is suitable for copper, aluminum, fiberglass-reinforced plastics, and oily steel. The product is particularly effective in bonding dissimilar materials that are exposed to wide thermal variations and mechanical stresses, ensuring reliable joints in demanding industrial assemblies.
3. Typical Properties
| Property | Uncured Material | Cured Material |
|---|---|---|
| Specific Gravity | 1.15 | – |
| Press Flow | 65 seconds | – |
| Sag Resistance | 12.7 mm | – |
| Shelf Life @ 0–4°C | 4.5 months | – |
| Cure Schedule | 90 min @ 100°C / 30 min @ 120°C / 20 min @ 150°C | Post-cure: 2–4 hrs at use temperature |
| Hardness (Shore D) | – | 78 @ 25°C; 35 @ 120°C |
| Lap Shear Strength (Al @25°C) | – | 40 N/mm² (5,800 psi) |
| Lap Shear Strength (Al @100°C) | – | 20.3 N/mm² (2,950 psi) |
| Lap Shear Strength (Steel @25°C) | – | 32.4 N/mm² (4,700 psi) |
| Peel Strength (Al) | – | 5.25 N/mm (30 lb/in) |
| Operating Temperature | – | -40 to +150 °C |
LOCTITE ABLESTIK G 909 combines non-sag handling with superior shear and peel performance, ensuring long-term strength and stability in structural bonding of varied substrates under thermal and mechanical stress.
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