LOCTITE ABLESTIK ICP 3920 is a one-component, electrically conductive epoxy adhesive. It is designed for fine dispense or printing applications in SMT assembly. The formulation features low viscosity, low CTE, improved dispensability, and long work life, making it a Pb-free alternative to solder. The adhesive cures at low temperatures with no post-cure required.
| Property | Value |
|---|---|
| Technology | Epoxy |
| Appearance | Silver |
| Viscosity (5 rpm, Cone & Plate) | 26,100 mPa·s (cP) |
| Thixotropic Index (25°C) | 5.7 |
| Shelf Life (@ -40°C) | 6 months |
| Cure Schedule | Condition |
|---|---|
| Batch Cure | 5 min @ 150°C |
| Property | Value |
|---|---|
| Glass Transition Temperature (Tg) | 119°C |
| Coefficient of Thermal Expansion (CTE) | 29 ppm/°C (Below Tg), 130 ppm/°C (Above Tg) |
| Volume Resistivity (25°C) | 0.0003 Ω·cm |
| Extractable Ionic Content (ppm) | Cl-: 5.1, Na+: 0.6, K+: 0.2 |
| Condition | Strength |
|---|---|
| @ 25°C | 36.5 N/mm² (5,290 psi) |
| @ 25°C, after 30s @ 250°C | 22.7 N/mm² (3,290 psi) |
| @ 250°C | 1.7 N/mm² (250 psi) |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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