LOCTITE ABLESTIK ICP 3920 is a one-component, electrically conductive epoxy adhesive. It is designed for fine dispense or printing applications in SMT assembly. The formulation features low viscosity, low CTE, improved dispensability, and long work life, making it a Pb-free alternative to solder. The adhesive cures at low temperatures with no post-cure required.
| Property | Value |
|---|---|
| Technology | Epoxy |
| Appearance | Silver |
| Viscosity (5 rpm, Cone & Plate) | 26,100 mPa·s (cP) |
| Thixotropic Index (25°C) | 5.7 |
| Shelf Life (@ -40°C) | 6 months |
| Cure Schedule | Condition |
|---|---|
| Batch Cure | 5 min @ 150°C |
| Property | Value |
|---|---|
| Glass Transition Temperature (Tg) | 119°C |
| Coefficient of Thermal Expansion (CTE) | 29 ppm/°C (Below Tg), 130 ppm/°C (Above Tg) |
| Volume Resistivity (25°C) | 0.0003 Ω·cm |
| Extractable Ionic Content (ppm) | Cl-: 5.1, Na+: 0.6, K+: 0.2 |
| Condition | Strength |
|---|---|
| @ 25°C | 36.5 N/mm² (5,290 psi) |
| @ 25°C, after 30s @ 250°C | 22.7 N/mm² (3,290 psi) |
| @ 250°C | 1.7 N/mm² (250 psi) |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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