LOCTITE ABLESTIK ICP 4001 is a one-component, silicone-based, electrically conductive adhesive designed for attaching devices and mounting components in circuit assembly applications. It provides:
| Property | Value |
|---|---|
| Solids Content | 85% |
| Viscosity @ 15 s⁻¹ | 40,000 mPa·s (cP) |
| Increase in viscosity after 24 hours at RT | <50% |
| Thixotropic Index | 2.1 |
| Density | 3.9 g/cm³ |
| Shelf Life (@ -40°C) | 4 months |
| Cure Schedule | Time & Temperature |
|---|---|
| Heat Cure | 35 minutes @ 140°C |
| Property | Value |
|---|---|
| Hardness (Shore A) | >75 |
| Elongation at break | >30% |
| Young’s Modulus (E) @ 0°C | 40 N/mm² (5,800 psi) |
| Coefficient of Thermal Expansion | 370 ppm/°C |
| Thermal Conductivity | 2.3 W/(m·K) |
| Property | Value |
|---|---|
| Volume Resistivity | 4×10⁻⁴ ohm·cm |
| Property | Value |
|---|---|
| Tensile Lap Shear Strength (Al to Al) | >1.7 N/mm² (245 psi) |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
HQ address: Thu Duc, Ho Chi Minh City, VietNam
Website: techniq.vn
Email: info@techniq.vn
Tel: +84 88 990 19 29
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