LOCTITE ABLESTIK ICP 9000 is a silver-filled, semi-sintering adhesive designed for high-power and high-temperature electronic device assembly. It offers:
| Property | Value |
|---|---|
| Appearance | Silver liquid |
| Filler Type | Silver |
| Viscosity @ 5 rpm (Brookfield) | 11,500 mPa·s (cP) |
| Thixotropic Index (0.5/5 rpm) | 5.5 |
| Work Life @ 25°C | 16 hours |
| Open Time @ 25°C | 2 hours |
| Shelf Life @ -40°C | 365 days |
| Cure Condition | Time & Temperature |
|---|---|
| Conventional Oven (<5×5 mm die) | 200°C for 1 hour |
| Conventional Oven (>5×5 mm die) | 130°C for 120 min → 200°C for 120 min |
| Alternate Cure (Ag, Au, PPF substrates) | 130°C for 30 min → 175°C for 60 min |
| Property | Value |
|---|---|
| Glass Transition Temperature (Tg) | 25°C |
| Thermal Conductivity | 100 W/m-K |
| Volume Resistivity | 7 × 10⁻⁶ ohm-cm |
| Moisture Absorption | 0.21% |
| Die Size | Ag (kg-f) | Cu (kg-f) | PPF (kg-f) |
|---|---|---|---|
| 1 × 1 mm | 1.5 | 1.6 | 1.2 |
| 2 × 2 mm | 5.0 | 6.5 | 4.5 |
| 3 × 3 mm | 10.9 | 10.8 | 10.0 |
| Substrate | Resistance (K/W) |
|---|---|
| Ag | 0.45 |
| PPF | 0.45 |
| Property | Value |
|---|---|
| TML | 0.2% |
| CVCM | 0.02% |
| WVR | 0.03% |
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Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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