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LOCTITE® ABLESTIK NCA 01UV – UV curable epoxy adhesive – Automotive ADAS camera module bonding

  • Item Name: LOCTITE® ABLESTIK NCA 01UV
  • Manufacturer: Henkel
  • Product Category: UV-Curable Epoxy Adhesive
  • Technologies: UV cure, High Tg, Low CTE, Low shrinkage, SVHC & Antimony free
  • Applications: Automotive camera module bonding (lens barrel-to-housing, lens housing-to-circuit board)
  • Color: Milky white
  • Cure Type: UV light (365 nm, 1000 mW/cm², 3 sec)
  • Package Size: Contact Techniq VN for details.
  • Shelf Life: 6 months (@ -40°C)

1. Product Overview

  • Technology: UV-curable epoxy
  • Appearance: Milky white
  • Key Benefits:
    • One-step full UV cure
    • High glass transition temperature (Tg) and low coefficient of thermal expansion (CTE)
    • Low shrinkage
    • Free from SVHC and Antimony

2. Applications

  • Industry: Automotive
  • Typical Uses:
    • ADAS optical module bonding
    • Camera module assembly
    • Lens barrel-to-housing and lens housing-to-circuit board bonding
  • Curing: Requires UV light exposure, no thermal post-cure needed

3. Typical Properties

Property Typical Value Condition/Method
Uncured Properties
Viscosity @ 25°C 27,700 mPa.s 15 s⁻¹ shear rate
Shear Thinning Index 5.6 1.5/15 s⁻¹
Density 1.8 g/cm³ 25°C
Shelf Life 6 months -40°C storage
Curing Performance
UV Wavelength 365 nm LED light source
Irradiance at Bond Line 1000 mW/cm²
Recommended Cure Time 3 seconds
Cured Properties
Glass Transition Temperature (Tg) 124°C DMA, tan δ
Storage Modulus @ 25°C 7100 MPa DMA, Single Cantilever
CTE (Coefficient of Thermal Expansion) 20.2 ppm/K -30 to 70°C
Hardness Shore D: 94 Durometer
Dimensional Change 0.4%
Cure Depth 8 mm
Residual Enthalpy <10 J/g
Adhesion Strength (Die Shear, Plasma-Treated)
Aluminum to Aluminum 10.1 N/mm² (1395 psi)
Outgassing Properties
Total Mass Loss 0.27%
Recovered Mass Loss 0.17%
Collected Volatile Condensable Material 0.00%

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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