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LOCTITE ABLESTIK NCA 2280 – Dual cure adhesive – Image sensor module assemblies

  • Item Name: LOCTITE ABLESTIK NCA 2280
  • Manufacturer: Henkel
  • Product Category: Adhesive
  • Technologies: Acrylated Epoxy, Dual Cure System (UV + Heat)
  • Applications: Image sensor module assemblies, bonding ceramics and LCP
  • Color: Black
  • Cure Type: UV light followed by heat cure
  • Package Size: Contact Techniq VN for details
  • Shelf Life: 6 months

1. Product Overview

  • Product Name: LOCTITE ABLESTIK NCA 2280
  • Technology: Acrylated Epoxy
  • Appearance: Black
  • Key Benefits:
    • Non-conductive
    • One-component
    • Dual cure system (UV + heat)
    • High thixotropic index & viscosity
    • Prevents light penetration
    • Fast cure at low temperature
    • Good adhesion to LCP

2. Applications

  • Assembly Type: Image sensor module assemblies
  • Key Substrates: Ceramics, LCP
  • Special Features:
    • High viscosity and thixotropy for better dispensing
    • Temporary UV cure for adjustments before heat curing

3. Typical Properties

Uncured Material

Property Value
Viscosity (mPa∙s) 54,000
Thixotropic Index 4.4
Specific Gravity (g/cm³) 1.3
Pot Life @ 25ºC 3 days
Shelf Life @ -20°C 183 days

Curing Performance

Cure Type Condition Details
UV Cure High-pressure mercury lamp Wavelength: 220–380 nm, Intensity: 100 mW/cm²
Exposure Time 2 sec 0.4 mm depth
10 sec 0.8 mm depth
Heat Cure 80°C 30 minutes

Cured Material Properties

Property Value
Hardness (Shore D) 90
CTE (ppm/°C) Below Tg 45
CTE (ppm/°C) Above Tg 156
Glass Transition Temp (°C) 90
Modulus @ 25°C (GPa) 4.5

Performance

Property Value
Die Shear Strength (LCP, SiN Chip) 20 N/mm² (2,900 psi)

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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