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LOCTITE ABLESTIK NCA 2340 – Dual cure adhesive – Active alignment camera module assembly

  • Item Name: LOCTITE ABLESTIK NCA 2340
  • Manufacturer: Henkel
  • Product Category: Adhesive
  • Technologies: Acrylated Epoxy, Dual Cure System (UV + Heat)
  • Applications: Active alignment camera module assembly
  • Color: Light yellow
  • Cure Type: UV light activation followed by heat cure
  • Package Size: Contact Techniq VN for details
  • Shelf Life: 6 months

1. Product Overview

  • Product Name: LOCTITE ABLESTIK NCA 2340
  • Technology: Acrylated Epoxy
  • Appearance: Light yellow liquid
  • Key Benefits:
    • UV curable
    • Excellent adhesion
    • High viscosity
    • High thixotropic index
  • Curing Method: UV light activation followed by heat cure

2. Applications

  • Assembly Type: Active alignment camera module assembly
  • Key Substrates: Aluminum (Al), PBT, LCP, PCB
  • Special Features:
    • Designed for temperature-sensitive electronic components
    • Temporary UV cure allows for adjustments before heat curing

3. Typical Properties

Uncured Material

Property Value
Viscosity (mPa∙s) @ Shear rate of 10 s⁻¹ 35,000
Thixotropic Index 5.3
Work Life @ 25°C (days) 3
Shelf Life @ -20°C (days) 180

Curing Performance

Cure Type Condition Details
UV Cure UV LED Wavelength: 220–375 nm, Intensity: 1,000 mW/cm²
Exposure Time 1 sec UV LED @ 365 nm, 1,000 mJ
Heat Cure 90°C 60 minutes

Cured Material Properties

Property Value
Hardness (Shore D) 83
Glass Transition Temp (°C) 83
CTE (ppm/°C) Below Tg 61
CTE (ppm/°C) Above Tg 195
Storage Modulus (GPa) 3
Extractable Ionic Content (ppm) – Chloride (Cl⁻) 425

Performance

Property Value
Die Shear Strength (Si die on glass, UV cure) 6 N/mm²
Die Shear Strength (Si die on FR5, heat cure) 40 N/mm²

BERGQUIST microTIM mTIM 1028 Thermal Interface Coating High performance thermal management solution for nickel finished heat sinks, optical transceivers, and data center liquid cooling systems

BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.

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