LOCTITE ABLESTIK NCA 2360 is a black, one-component epoxy adhesive designed for fast curing at low temperatures. It offers good adhesion and is suitable for heat-sensitive devices.
| Property | Value |
|---|---|
| Viscosity (Brookfield CP51, 25°C, 5 rpm) | 6,296 mPa·s (cP) |
| Thixotropic Index | 3.2 |
| Pot Life (@ 25°C) | 3 days |
| Shelf Life (@ -40°C) | >183 days |
| Condition | Duration |
|---|---|
| Hot plate | 2 min @ 80°C |
| Conventional oven | 30 min @ 80°C |
| Weight Loss on Cure | 0.21% |
| Property | Value |
|---|---|
| Hardness (Shore D) | 75 |
| Coefficient of Thermal Expansion (ppm/°C) | Below Tg: 53, Above Tg: 171 |
| Glass Transition Temperature (Tg) | 33°C |
| Volumetric Shrinkage on Cure | 2.8% |
| Elongation at Break | 110% |
| Tension Modulus | @ 25°C: 2,054 N/mm² (297,907 psi), @ 85°C: 20 N/mm² (2,900 psi) |
| Property | Value |
|---|---|
| Lap Shear Strength | 14 N/mm² (2,030 psi) |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
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