Applications

LOCTITE ABLESTIK NCA 3280 – Non-conductive adhesive – Lens bonding, image sensors, MMC assembly

  • Item Name: LOCTITE ABLESTIK NCA 3280
  • Manufacturer: Henkel
  • Product Category: Non-conductive adhesive
  • Technologies: Epoxy, heat-curable
  • Applications: Lens bonding, image sensors, MMC assembly
  • Color: White
  • Cure Type: Heat cure (fast cure at low temperatures)
  • Package Size: Contact Techniq VN for details.
  • Shelf Life: 12 months (365 days) at -20°C

1. Product Overview

LOCTITE ABLESTIK NCA 3280 is a one-component, heat-curing epoxy adhesive designed for applications requiring fast cure at low temperatures. It provides excellent adhesion, high service temperature reliability, and is halogen-free. This adhesive is white in color, offering high light reflectivity, making it ideal for optical applications.

Key Benefits:

  • Fast curing at low temperatures
  • High service temperature reliability
  • Excellent adhesion
  • Halogen-free formulation

2. Applications

LOCTITE ABLESTIK NCA 3280 is used in applications where low-temperature curing and high adhesion are required, including:

  • Lens bonding
  • Image sensor assembly
  • Multimedia card (MMC) assembly
  • LED light-diffusing lens bonding

3. Typical Properties

Uncured Properties

Property Value
Technology Epoxy
Appearance White
Viscosity @ 2 s⁻¹ (mPa·s) 46,100
Viscosity @ 20 s⁻¹ (mPa·s) 12,400
Thixotropic Index 3.7
Specific Gravity 1.31
Pot Life @ 25ºC >7 days
Shelf Life @ -20ºC 365 days

Curing Performance

Cure Schedule Condition
Recommended Cure 2 minutes @ 80°C
Alternative Cure 30 minutes @ 80°C

Cure rate depends on material mass and heat exposure. Users should validate optimal cure conditions for their specific applications.

Cured Properties

Property Value
Hardness (Shore D) 80
Glass Transition Temperature (Tg) 54°C
Coefficient of Thermal Expansion (CTE) (ppm/°C) Below Tg: 58 Above Tg: 171
Modulus (N/mm²) 2,800 (406,105 psi)
Volumetric Shrinkage on Cure (%) 3.9
Linear Shrinkage on Cure (%) 1.3

Lap Shear Strength (Cured at 80°C for 30 min)

Substrate Strength (N/mm²) Strength (psi)
Glass Epoxy to Glass Epoxy 23.7 3,437

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