LOCTITE ABLESTIK XCE 3104XL is a one-component, thermosetting, electrically conductive epoxy adhesive designed for fine stencil and screen print applications in SMT assembly. It features a controlled particle size, low-temperature cure, and Pb-free alternative to solder, making it suitable for high-speed stencil printing with long work life.
| Property | Value |
|---|---|
| Appearance | Silver |
| Viscosity (Brookfield CP52, 5.0 rpm) | 54,000 mPa·s (cP) |
| Shear Thinning Index | 4.9 |
| Pot Life (Static) | 2 days |
| Shelf Life @ -40°C | 183 days |
| Cure Schedule | Time & Temperature |
|---|---|
| Standard Cure | 15 minutes @ 125°C |
| Alternate Cure | 10 minutes @ 150°C |
| Reflow Compatibility | Cures completely in a standard reflow cycle |
| Property | Value |
|---|---|
| Coefficient of Thermal Expansion (CTE) | 46 ppm/°C (below Tg), 160 ppm/°C (above Tg) |
| Glass Transition Temperature (Tg) | 109°C (TMA), 136°C (DMA) |
| Thermal Conductivity | 1.8 W/m-K |
| Modulus @ 25°C | 6,600 N/mm² (957,250 psi) |
| Modulus @ 150°C | 400 N/mm² (58,015 psi) |
| Volume Resistivity | 0.0005 ohm-cm |
| Test Condition | OSP Cu | Ni/Au |
|---|---|---|
| Contact Resistance (Initial/After 1,000h @ 85°C, 85% RH) | 16/16 mΩ | 16/16 mΩ |
| Contact Resistance (Initial/After 1,000h @ 125°C) | 17/14 mΩ | 15/16 mΩ |
| Die Shear Strength (100×100 mil Si die on Al leadframe) | ≥28 Kg | |
| Component Shear Strength (0805 SnPb resistors) | 6.9 Kg (OSP Cu), 6.7 Kg (Ni/Au) |
BERGQUIST® GAP FILLER TGF 2900LVO, a silicone-based 2-component system, delivers optimized heat transfer across ultra-thin bondline interfaces. It is engineered for automotive control modules, high-throughput manufacturing lines, and electronics sensitive to siloxane outgassing, ensuring stable operation in environments spanning -40 °C to +150 °C.
BERGQUIST® LIQUI FORM TLF 10000 addresses critical hotspots in RRU/AAU/BBU units, EV battery packs, 5G antenna modules, industrial controllers, and compact PCBs while stabilizing vertical gaps ≤2.5 mm and preserving electrostatic reliability.
TECHNOMELT® Low Pressure Molding polyamides deliver precision encapsulation of PCBs, PCBAs, connectors, sensors, power modules, LEDs, HVAC controllers, and wearable medical devices, while also enabling leakproof integration in liquid-delivery systems.
Huntsman ARALDITE® systems are designed for • Rotor potting to replace permanent magnets in magnetless motor concepts • Stator encapsulation for enhanced coil protection • High voltage impregnation processes ensuring worker safety and long term adhesion.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
Through partnerships with leading global brands, we deliver high-value materials, expert consulting, and optimized supply chains ensuring timely delivery, efficiency, and sustainable growth for our clients.
At Techniq, our mission is to connect cutting-edge materials, processes, and equipment with customer needs, enabling efficiency, reliability, and long-term value creation.
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