LOCTITE ABLESTIK XCE 3104XL is a one-component, thermosetting, electrically conductive epoxy adhesive designed for fine stencil and screen print applications in SMT assembly. It features a controlled particle size, low-temperature cure, and Pb-free alternative to solder, making it suitable for high-speed stencil printing with long work life.
| Property | Value |
|---|---|
| Appearance | Silver |
| Viscosity (Brookfield CP52, 5.0 rpm) | 54,000 mPa·s (cP) |
| Shear Thinning Index | 4.9 |
| Pot Life (Static) | 2 days |
| Shelf Life @ -40°C | 183 days |
| Cure Schedule | Time & Temperature |
|---|---|
| Standard Cure | 15 minutes @ 125°C |
| Alternate Cure | 10 minutes @ 150°C |
| Reflow Compatibility | Cures completely in a standard reflow cycle |
| Property | Value |
|---|---|
| Coefficient of Thermal Expansion (CTE) | 46 ppm/°C (below Tg), 160 ppm/°C (above Tg) |
| Glass Transition Temperature (Tg) | 109°C (TMA), 136°C (DMA) |
| Thermal Conductivity | 1.8 W/m-K |
| Modulus @ 25°C | 6,600 N/mm² (957,250 psi) |
| Modulus @ 150°C | 400 N/mm² (58,015 psi) |
| Volume Resistivity | 0.0005 ohm-cm |
| Test Condition | OSP Cu | Ni/Au |
|---|---|---|
| Contact Resistance (Initial/After 1,000h @ 85°C, 85% RH) | 16/16 mΩ | 16/16 mΩ |
| Contact Resistance (Initial/After 1,000h @ 125°C) | 17/14 mΩ | 15/16 mΩ |
| Die Shear Strength (100×100 mil Si die on Al leadframe) | ≥28 Kg | |
| Component Shear Strength (0805 SnPb resistors) | 6.9 Kg (OSP Cu), 6.7 Kg (Ni/Au) |
LOCTITE ECCOBOND UF 9000AG-061 is specifically formulated for FCBGA and Cu pillar flip chip packaging, ensuring robust solder joint encapsulation under extreme electrothermal cycling from -65 °C to 150 °C. Its superior capillary flow also optimizes throughput in automated assembly lines for high-density ICs.
BERGQUIST microTIM mTIM 1028 is purpose built for riding cage assemblies in servers, switches, and routers, interfacing with electroless nickel plated copper or aluminum heat sinks. It ensures stable operation in high power transceiver modules while also extending applicability to liquid cooling components, heat pipes, and fin based dissipative structures.
LOCTITE® ABLESTIK NCA 3218 is specifically formulated for ADAS optical modules, ensuring secure bonding in lens barrel to housing and lens housing to circuit board interfaces where dimensional accuracy and dielectric integrity are non negotiable.
Loctite® 3296, a dual cure (UV & thermal) adhesive, is engineered for active alignment assembly of ADAS cameras and LiDAR modules. Its optimized bonding to aluminum and FR4 substrates ensures secure fixation of optical components while enabling nanometer level alignment critical for high resolution imaging.
Techniq Vietnam provides end-to-end materials and process solutions, integrating world-class technologies in adhesives, soldering, and thermal management.
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